“…[ 21,31,53–56 ] First, the orthogonal configuration of the voltage output to the heat flow enables the lateral thermopile structure consisting of a magnetic material and electrodes (Figure 6b), formed on the various substrate including flexible films. [ 55,56 ] Second, as the ANE voltage V ANE follows the relation, V ANE = S ANE × l × ∇ T film , namely, being proportional to the anomalous Nernst coefficient S ANE , the total length l of the magnetic circuit, and the temperature gradient ∇ T film , the thin film device would be the best for the sensor as its low thermal resistance would not disturb the heat flow across the specimen. Thus, the conventional thin film fabrication and lithography methods are applicable for fabrication, reducing the number of production processes and the associated costs in comparison with the conventional Seebeck case.…”