Adhesion in Microelectronics 2014
DOI: 10.1002/9781118831373.ch5
|View full text |Cite
|
Sign up to set email alerts
|

Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2017
2017
2019
2019

Publication Types

Select...
3
3

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(1 citation statement)
references
References 149 publications
0
1
0
Order By: Relevance
“…To stabilize the electrical connection in the stretchable FCB systems, current solutions prefer to stiffen the soft substrate around the connection areas and create a permanent electrical connection between the conductive tracks and other electronic components. At present, most electrical connections in flexible and stretchable electronic systems [20,21,22,23,24,25] are based on different types of carriers established by soldering [26,27,28,29,30] and conductive adhesives [28,31,32], such as silver-filled epoxy [33], silicone adhesive and single-wall carbon nanotube conductive rubber paste [34], along with subsequent encapsulation of contact areas with the glob-top cover using polydimethylsiloxane (PDMS) rubber [35] or epoxy resin. However, such electrical connections introduce higher-modulus materials and weaken the flexibility, deformability, and mechanical behavior of the electronic assembly, compromising the electrical performance of stretchable electronics.…”
Section: Introductionmentioning
confidence: 99%
“…To stabilize the electrical connection in the stretchable FCB systems, current solutions prefer to stiffen the soft substrate around the connection areas and create a permanent electrical connection between the conductive tracks and other electronic components. At present, most electrical connections in flexible and stretchable electronic systems [20,21,22,23,24,25] are based on different types of carriers established by soldering [26,27,28,29,30] and conductive adhesives [28,31,32], such as silver-filled epoxy [33], silicone adhesive and single-wall carbon nanotube conductive rubber paste [34], along with subsequent encapsulation of contact areas with the glob-top cover using polydimethylsiloxane (PDMS) rubber [35] or epoxy resin. However, such electrical connections introduce higher-modulus materials and weaken the flexibility, deformability, and mechanical behavior of the electronic assembly, compromising the electrical performance of stretchable electronics.…”
Section: Introductionmentioning
confidence: 99%