ISSI 2021: Direct-ink-writing printed strain rosette sensor array with optimized circuit layout

Abstract

The full-field multiaxial strain measurement is highly desired for application of structural monitoring but still challenging, especially when the manufacturing for large-area sensing devices is quite difficult. In this work we propose an integrated strategy from layered circuit scheme to rapid manufacturing of strain rosette sensor array based on the direct-ink-writing (DIW) technology. Benefit from the innovative design with simplified circuit layout and the advantages of DIW for printing multilayer structures, here we achieve optimization design principle for strain rosette sensor array with scalable circuit layout, which enable a hierarchical printing strategy for multiaxial strain monitoring in large scale or multiple domains. The strategy is highly expected to adapt for the emerging requirement in various applications such as integrated soft electronics, nondestructive testing and small-batch medical devices.