Jet-type, water-cooled heat sink that yields 255-W continuous-wave laser output at 808 nm from a 1-cm laser diode bar

Miyajima, Hirofumi; Kan, Hirofumi; Kanzaki, Takeshi; Furuta, Shunsuke; Yamanaka, Masanobu; Izawa, Yasukazu; Nakai, S.

doi:10.1364/ol.29.000304

Cited by 25 publications

(4 citation statements)

References 8 publications

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“…The cooling liquid flows through the bottom, and the cooling liquid injected through the 300 mm hole impacts the rough surface of the target plate to improve the cooling efficiency. The thermal resistance of the 255 W output laser can be controlled at 0.25°C/W [54]. The jet impingement cooling technology is usually applied to nuclear reactors' heat dissipation, and other superheat fluxes.…”

Section: Jet Impingement Coolingmentioning

confidence: 99%

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Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology

Yan

Zheng

Sun³

et al. 2021

Front. Phys.

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In the past 20 years, semiconductor lasers have been widely used in medical, industrial, and communication applications, providing a revolutionary and powerful platform for the fifth generation and advanced manufacturing. Semiconductor laser has the advantages of small size, lightweight, high reliability and easy modulation, becoming increasingly popular. However, due to the laser diode emission mechanism limitation, the beam quality is inferior and cannot be directly applied and required to be handled by beam shaping. However, the packaging of multiple beam shaping optical components is accompanied by risks due to misalignment. The misalignment error of the optical components has a great hidden danger to the laser performance. As semiconductor lasers' power gradually increases, lasers' thermal management technology is also increasingly strict. Therefore, this article first reviews the beam shaping technology of semiconductor laser diode array. Secondly, the analysis of the influence of the array semiconductor laser optical device's misalignment is reviewed, and a feasible solution is proposed. Finally, it summarizes the researches on thermal management in high-power semiconductor lasers. This article aims to give readers a comprehensive and broad understanding of semiconductor laser packaging's technical difficulties and to recognize each corresponding solution.

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Section: Jet Impingement Coolingmentioning

confidence: 99%

“…Adapted from[53]; (B) Schematic diagram of a device that combines water-cooling heat dissipation and jet impact heat dissipation. Adapted from[54].…”

mentioning

confidence: 99%

Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology

Yan

Zheng

Sun³

et al. 2021

Front. Phys.

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“…Furthermore, high-power laser-diode arrays have been greatly advanced; for example, CW 255 W output power has been demonstrated with a single 1-cm diode array [13]. The increment of laser-diode power benefits realization of the IFE driver with regard to the cost of the development as well as miniaturization and performance improvement.…”

Section: Feasibility and Issues Of Ife Drivermentioning

confidence: 99%

Development of diode‐pumped solid‐state laser HALNA for fusion reactor driver

Kawashima

Kanabe

Matsumoto

et al. 2006

Electrical Engineering Japan

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SUMMARYThe diode-pumped slab laser for inertial fusion energy driver has been demonstrated, which produces the 1053-nm output energy of 10 J at 10 Hz. The glass slab laser amplifier has been pumped by quasi-CW 290-kW AlGaAs laser-diode arrays at 803 nm. The optical system can compensate for thermal effects by use of zigzag optical propagation, image-relayed telescope, and 45° Faraday rotator. The output energy of 10.6 J at 1 Hz with the optical-to-optical conversion efficiency of 19.9% has been successfully obtained. Also, the 10-Hz operation has been performed with an output energy of 5.1 J.

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“…Several types of heat sink have been developed for high-power LD arrays, such as silicon microchannel heat sinks, 1,2) copper microchannel heat sinks, 3,4) and funryu heat sinks. [5][6][7] For the silicon microchannel heat sink, a huge current flows at its metallized surface layer that is typically 10 mm thick, and heat flows through the silicon substrate which has a relatively low thermal conductivity. As a result, Joule heating at the surface cannot be neglected when attempting to achieve stable operation of an LD array.…”

Section: Introductionmentioning

confidence: 99%

High-Power Operation of 1 cm Laser Diode Bars on Funryu Heat Sink Cooled by Fluorocarbons

Miyajima¹,

Suzuki²,

Ohishi³

et al. 2005

Jpn. J. Appl. Phys.

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We have investigated the properties of fluorocarbons as coolants for a high-power laser diode bar mounted on a funryu-jet heat sink. The thermal conductivities of fluorocarbons are about ten times lower than that of water, but they are less corrosive to the funryu copper heat sink and their boiling points may be higher than that of water. Since the cooling efficiency of such a high power laser diode (LD) bar may be a result of the dynamic viscosity, the heat capacity, the thermal resistance, and the boiling temperature of the coolant, we have compared two types of “Fluorinert”, 3M's FC77 and FC43, and water as coolants. Wavelength distributions along a 1 cm bar, operated under a 52 A driving current, are measured to be ±1.1 nm for FC77, ±2.1 nm for FC43 and ±0.6 nm for water. From their thermal and material characteristics given by 3M, the lower viscosity of FC77 is important for our funryu heat sink, which has a high flow resistance. A thermal resistance of 0.7°C/W is achieved at a flow rate of 1.0 L/min for FC77. FC77 is adopted as the coolant for CW 30 W operation and has operated continuously for over 800 h.

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Jet-type, water-cooled heat sink that yields 255-W continuous-wave laser output at 808 nm from a 1-cm laser diode bar

Cited by 25 publications

References 8 publications

Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology

Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology

Development of diode‐pumped solid‐state laser HALNA for fusion reactor driver

High-Power Operation of 1 cm Laser Diode Bars on Funryu Heat Sink Cooled by Fluorocarbons

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