2020
DOI: 10.1088/1742-6596/1559/1/012065
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Joining condition dependency of joint resistance in ultrasonic welding of high-temperature superconducting tapes with indium

Abstract: Ultrasonic welding (UW) is a candidate for easy and simple fabrication of lap joints of high-temperature superconducting (HTS) tapes. Our previous study applied UW to both silver-sheathed BSCCO tapes and copper-stabilized REBCO tapes with indium foil inserted in-between. However, the fabrication was performed with limited joining conditions and critical current, I C, degradation was confirmed in some of the BSCCO tape joints. In this study, we evaluated the joining-condition dependence … Show more

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Cited by 8 publications
(2 citation statements)
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“…To prevent I c degradation caused by the pyramidal tips of the tools, metal plates were inserted between the CC tapes and the horn and anvil. The quality of the joint was also dependent on the initial thickness of the In foil, which obtained a minimum R sj of 36.1 nΩ•cm 2 [41]. These studies demonstrate that UW and HW methods can be a promising approach for the in-line fabrication of longer tapes required for superconducting devices.…”
Section: Introductionmentioning
confidence: 73%
“…To prevent I c degradation caused by the pyramidal tips of the tools, metal plates were inserted between the CC tapes and the horn and anvil. The quality of the joint was also dependent on the initial thickness of the In foil, which obtained a minimum R sj of 36.1 nΩ•cm 2 [41]. These studies demonstrate that UW and HW methods can be a promising approach for the in-line fabrication of longer tapes required for superconducting devices.…”
Section: Introductionmentioning
confidence: 73%
“…Several low resistive joining methods such as Sn-Pb soldering [111], mechanical joint (pressure welding) with In foil inserts [112,113], hybrid welding combined with ultrasonic welding and In-Sn solder infiltration [114,115], and ultrasonic welding with In foil inserts [113,116], have been developed for HTS conductors of REBCO CCs and Bi-2223/Ag tapes. A joint resistivity (product of the joint resistance and joint area) of ∼15-50 nΩ cm 2 at 77 K in selffield was achieved.…”
Section: Low Resistive Joint For Hts Conductorsmentioning
confidence: 99%