2019
DOI: 10.1002/adem.201900719
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Joining of Graphite to Ti6Al4V Alloy Using Cu‐Based Fillers

Abstract: Joining of graphite to Ti6Al4V (TC4) alloy is achieved with three Cu-based fillers (Cu-22TiH 2 , Cu-50TiH 2 , and Cu-30TiH 2 -5Ni). Microstructural characterizations reveal that a thin TiC layer and a diffusion layer containing Ti solid solution (Ti(ss)) with Ti 2 Cu are developed at the graphite/filler layer and filler layer/TC4 interfaces, respectively. For the joint obtained with Cu-22TiH 2 filler, the filler layer consists of TiCu and Ti 2 Cu, whereas it is composed of Ti 2 Cu, TiCu, and Ti(ss) for the joi… Show more

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Cited by 8 publications
(12 citation statements)
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“…Gao et al claimed that Cu and Ni can replace each other to react with Ti, forming Ti 2 (Cu, Ni) or Ti(Cu, Ni) phases in Cu-Ti-Ni ternary environment. [29] The identification of Ti 2 (Cu, Ni) and Ti(Cu, Ni) was also confirmed by Duan et al [18] Notably, elements V and Al are detected in the filler layers. As claimed by Qin et al and Wang et al, Ti-Al and Ti-V compounds would be formed with Al content higher than 1 1 at% and V content higher than 34 wt%, respectively.…”
Section: Joint Microstructure With Nb Interlayermentioning
confidence: 53%
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“…Gao et al claimed that Cu and Ni can replace each other to react with Ti, forming Ti 2 (Cu, Ni) or Ti(Cu, Ni) phases in Cu-Ti-Ni ternary environment. [29] The identification of Ti 2 (Cu, Ni) and Ti(Cu, Ni) was also confirmed by Duan et al [18] Notably, elements V and Al are detected in the filler layers. As claimed by Qin et al and Wang et al, Ti-Al and Ti-V compounds would be formed with Al content higher than 1 1 at% and V content higher than 34 wt%, respectively.…”
Section: Joint Microstructure With Nb Interlayermentioning
confidence: 53%
“…In our previous study, graphite/TC4 brazing has been achieved with Cu-Ti-Ni filler. [18] As reported by Martienssen and Warlimont, the CTE values of Nb and Ta were 7.0 Â 10 À6 and 6.5 Â 10 À6 K À1 , respectively. [19] Considering that refractory metal such as Nb and Ta exhibits a high ductility and an intermediate CTE between those of graphite and TC4, the introduction of a refractory metal interlayer is expected to relax the joint stress by accommodating CTE mismatch between graphite and TC4.…”
Section: Introductionmentioning
confidence: 61%
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