Joining of Individual Silver Nanowires via Electrical Current

Vafaei, Arash; Hu, Anming; Goldthorpe, Irene A.

doi:10.1007/s40820-014-0001-9

Cited by 48 publications

(44 citation statements)

References 33 publications

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“…This decrease in resistance may reveal material transformation to a state which facilitates filament style channels based on solid state diffusion from the initial composite material which forced electrical hopping internally. 16,19 Between 240℃ to 300℃, the increase in Ag nanowire ink resistivity is mainly due to broken nanowires 16 while at the same temperatures only a slightly increase of in-plane resistivity of Ag nanoplate ink was observed, likely due to oxidation. Again, Ag nanoplate inks demonstrate superior thermal stability than Ag nanowire inks.…”

Section: Electrical Properties Of Ag Nanoplate Inksmentioning

confidence: 95%

Robust Ag nanoplate ink for flexible electronics packaging

Bridges

et al. 2015

Nanoscale

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Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 °C) was primarily due to adhesive bonding. It is found that, utilizing photonic sintering, ∼ 70 °C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 °C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. These results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.

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Section: Electrical Properties Of Ag Nanoplate Inksmentioning

confidence: 95%

Robust Ag nanoplate ink for flexible electronics packaging

Bridges

et al. 2015

Nanoscale

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“…Then the resulting sample was dried and washed in water to dissolve all the sodium-chloride, resulting in a porous block polymer sponge. [33] It is important to understand how the scale of these wires compares to the characteristic dimensions of the porous polymer-sponge structure. Next we cut sample into small rectangular strips, making it suitable for further mechanical testing.…”

Section: Fabrication and Morphological Characterizationmentioning

confidence: 99%

Toward Programmable Materials for Wearable Electronics: Electrical Welding Turns Sensors into Conductors

Chellattoan

Lube

Lubineau

2018

Adv Elect Materials

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again. [21,22] Thus, preserving material conductivity at large strains remains a real challenge. [23][24][25][26] One approach to maintaining conductivity is to better engineer the junctions among the conductive particles. Indeed, metallic nanowires are highly conductive, both electrically and thermally, [27] making it interesting nanomaterial for electronic and thermal applications. However, the junctions among the particles play a major role in both the electrical [28] and thermal [29] energy transfers within the network. Unlike the carbon-based nanoparticles, which are also often used for enhancing the electrical properties of polymers, the junction resistance of metal nanowires can be controlled by welding. Though several approaches have been developed for welding silver nanowire (AgNW) network, [28,[30][31][32] welding by joule heating with an electric voltage source (e-welding) is straightforward and economical. [28] In this way, the resistance of the junction can be efficiently controlled to transform an electrically conductive material from a stretchable sensor to a conductor. When polymeric sponge materials are made conductive by introducing metallic nanowires, the elevated and strain-dependent resistance of the initial interparticle junctions usually results in a sensor-like behavior. However, when subjected to an electrical current, the localized joule heating of the junctions enables the nanowires to weld together, resulting in a more conductor-like response.Here, we exemplify this using a conductive polymer sponge doped with a network of high-aspect-ratio AgNWs. The AgNWs are incorporated into the inner walls of the porous sponge to create an electrically conductive network. The piezoresistive response (measured by the gauge factor) of the conductive sponge can be controlled either by altering the initial percolated network of nanowires, or by progressive welding among the nanowires. In our experiments, the gauge factor progressively decreased as the level of e-welding increased. The material became progressively more conductive and less piezoresistive.In this paper, we demonstrate in detail the conversion of a sensor into a conductor by step-by-step welding of the AgNWs inside a polymer sponge using a DC-voltage source. In Section 2.1, we explain the fabrication and morphological characteristics of the soft, porous, stretchable, and conducting polymer sponge containing weakly connected AgNWs. Section 2.2 shows that the loosely connected AgNW network inside the sponge has high volume resistivity, depending on the degree of percolation. Poorly percolated AgNWs can slip one over another under linear strain (50% elongation) to produce sensor-like behavior, Stretchable electrical conductors and stretchable strain sensors are two key components in applications such as soft robotics, artificial soft skins, and wearable electronics. Very different approaches are usually implemented to design either conductors or sensors. Here, transformation of an electrically conductive material from a sensor to a conducto...

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“…Among such techniques, joining of fine-scale materials is vital. Various techniques to join fine-scale materials, such as metallic or semiconducting nanomaterials (Kim, et al, 2005;Xu, et al, 2005;Tohmyoh, et al, 2007;Lu, et al, 2010;Tan and Wang, 2013;Peng, et al, 2013;Vafaei, et al, 2014;Ma, et al, 2016) and carbon nanotube (Hirayama, et al, 2001;Dong, et al, 2007;Jin, et al, 2007) have been reported. Electron beam (Xu, et al, 2005), laser beam (Kim, et al, 2005;Hu, et al, 2012;Dai, et al, 2016), or light (Garnett, et al, 2012) is used to melt a fine-scale materials for joining.…”

Section: Introductionmentioning

confidence: 99%

Thermal boundary conditions around thin Pt wires under the current supply and its application for Joule heat welding of wires having various diameters

Tohmyoh

Yamaguchi

2019

Mechanical Engineering Journal

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This paper treats the Joule heat welding of thin Pt wires having various diameters. Joining of fine-scale materials, such as micro-or nanowires, has been essential to create advanced materials systems. Joule heat welding is one of the suitable way for this purpose. It has been reported that thin wires were welded together under the supply of constant direct current, and the welding condition was sensitive to the thermal boundary conditions around the wires under the current supply, which was affected by the heat transfer from the wire surface to the ambient and the heat conduction at the ends for the current supply. The diameters of thin Pt wires were 0.8-20 m, and the current required to cut the wire by Joule heating was investigated. The temperature of the wire having the smaller diameter was easily increased by Joule heating, and this became remarkable with increasing the slenderness ratio, i.e., the ratio of the diameter to the length for current supply. An index related to the temperature of the wire under the current supply was introduced to describe the thermal boundary conditions around the wire. The behavior of the index against the diameter was approximated by the exponential functions, and the thermal boundary conditions around the wires having various diameters became predictable. Finally, the validity of the thermal boundary conditions determined and predicted in this study was verified by conducting the experiments to cut and weld the wires by Joule heating.

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Joining of Individual Silver Nanowires via Electrical Current

Cited by 48 publications

References 33 publications

Robust Ag nanoplate ink for flexible electronics packaging

Robust Ag nanoplate ink for flexible electronics packaging

Toward Programmable Materials for Wearable Electronics: Electrical Welding Turns Sensors into Conductors

Thermal boundary conditions around thin Pt wires under the current supply and its application for Joule heat welding of wires having various diameters

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