Joining of Si3N4 ceramic using PdCo(NiSiB)–V system brazing filler alloy and interfacial reactions

Xiong, Hanguo; Chen, Bin; Pan, Yu; Guo, Wei; Mao, Wei; Ma, Qingsong

doi:10.1016/j.pnsc.2014.01.012

Cited by 10 publications

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“…It has been recognized that Pd is a useful alloying element in filler metals for ceramic joining . Within the Si 3 N 4 –Si 3 N 4 joint brazed with Au–Ni–Pd–V filler alloy, beside the VN reaction layer at the interface, two other solid solutions, Au[Ni,Pd] and Ni[Si,V], are formed in the central part of the joint after brazing at 1423 K for 60 min, whereas, in this study, the high concentration of Pd in the Cu–Pd–V filler alloy allows the formation of Pd 2 Si within the joint, and the central part of the joint is composed of Pd 2 Si and Cu 3 Pd compounds as well as (Cu, Pd) solid solution.…”

Section: Resultsmentioning

confidence: 64%

“…It has been recognized that Pd is a useful alloying element in filler metals for ceramic joining. 20,21,[36][37][38] Within the Si 3 N 4 -Si 3 N 4 joint brazed with Au-Ni-Pd-V filler alloy, 15 beside the VN reaction layer at the interface, two other solid solutions, Au[Ni,Pd] and Ni[Si,V], are formed in the central part of the joint after brazing at 1423 K for 60 min, whereas, in this study, the high concentration of Pd in the Cu-Pd-V filler alloy allows the formation of Pd 2 Si within the joint, and the central part of the joint is composed of Pd 2 Si and Cu 3 Pd compounds as well as (Cu, Pd) solid solution. Particularly, according to the Pd-Si binary diagram, 39 Pd 2 Si is the most refractory compound in the Pd-Si system, with a melting point of 1658 K. The presence of (Cu, Pd) phases and especially refractory Pd 2 Si compounds 40,41 within the joint should contribute to the stable strengths of the Si 3 N 4 -Si 3 N 4 joints at high temperatures between 873 K and 1073 K.…”

Section: August 2014 Interfacial Reactionsmentioning

confidence: 99%

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A Cu–Pd–V System Filler Alloy for Silicon Nitride Ceramic Joining and the Interfacial Reactions

et al. 2014

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A Cu–Pd–V brazing alloy with the composition of Cu–(38.0~42.0)Pd–(7.0~10.0)V (in wt.%) was designed as a filler for joining Si3N4. Its wettability on Si3N4 ceramic was measured with the sessile drop method. It was shown that the Cu–Pd–V alloy gave a contact angle of 71° at 1473 K. The filler alloy was fabricated into foils with a thickness of 0.15 mm. The Si3N4–Si3N4 joints brazed at 1443 K for 10 min exhibit average three‐point bend strength of 263 MPa at room temperature, and the joint strengths at 973 K and 1073 K are 277 MPa and 218 MPa, respectively. The analysis results of SEM, XRD, and TEM for the brazed joint indicate the presence of V2N at the surface of the Si3N4. The increase of the thickness of V2N reaction layer obeyed parabolic law, and the parabolic rate constant (k) can be described as k = 2.8739 × 10−9 exp(−162989.4/RT) m2/s. Pd2Si and Cu3Pd compounds as well as (Cu, Pd) solid solution were detected in the central part of the joints. The presence of (Cu, Pd) phases and especially refractory Pd2Si compounds within the joints should contribute to the stable high‐temperature property. The interfacial reaction mechanisms were discussed.

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Section: Resultsmentioning

confidence: 64%