Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

Abstract

Active brazing is a commonly used method for joining dissimilar materials with at least one non-metallic component. In the present study, joining of SiO2 glass to 316L stainless steel was performed utilizing Bi–Ag-based solders. Ti up to a concentration of 4 and Mg up to 1 wt.% were added as active elements. Microstructures of the solder alloys in the as-cast state and of cross sections of the joined compounds were analysed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. In the as-cast state of the solder, Ti is found in Bi–Ti intermetallic phases; Mg is partially dissolved in the fcc-(Ag) phase and additionally contained in a ternary Ag-Bi-Mg phase. After soldering, a tight joint was generated using several alloy compositions. Ti leads to the formation of reaction products at the steel/solder and glass/solder interfaces, and Mg is exclusively accumulated at the glass/solder interface.

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

“…The average shear strength of the AlN/Sn-Ag-Ti/Cu joint was 29.5 MPa. Weber and Rettenmayr [22] used an active Bi-Ag based solder with the addition of Ti and Mg for soldering the combination of SiO 2 and stainless-steel type 316 L. The joint was fabricated at the temperature of 780 • C in a shielding atmosphere of argon. In the solder/stainless steel boundary, a reaction layer of Fe-Ti-Bi was identified.…”