Joining of Steel to Aluminum Alloy by AC Pulse MIG Welding

Park, Hyoung Jin; Rhee, Sehun; Kang, Minjung; Kim, Dong Cheol

doi:10.2320/matertrans.m2009105

Cited by 46 publications

(25 citation statements)

References 8 publications

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“…The maximum joint strength was reported to be 80 MPa with phase layer thickness around 0.9 ~ 2.5 ㎛ 12) . Park et al 36) used AC pulsed GMA process to join 1.4 mm thick uncoated steel and 1.6 mm thick AA6K21 alloy by AA4043 filler wire. The phase layer thickness was contained within 1.14 ~ 3.2 ㎛ and the maximum joint strength was achieved as 173 MPa 36) .…”

Section: Gas Metal Arc Based Joiningmentioning

confidence: 99%

Laser and Gas Metal Arc Based Dissimilar Joining of Automotive Aluminium Alloys and Steel Sheets - A Review

Das

Bang

2018

Journal of Welding and Joining

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Multi-material joining of aluminium to steel is mainly restricted due to their different thermo-physical properties, melting temperatures, low solubility and in particular, formation of brittle intermetallic phase layer at the joint interface. Various joining processes have been attempted to join aluminium and steel sheets with an aim to reduce the growth of phase layer by precise control of heat input. However, laser beam and arc based joining processes are popular among other joining processes due to their strict control of heat input with regulative metal transfer and flexibility to join intricate shapes. A critical survey in joining aluminium to steel sheets by laser beam and arc based joining processes are presented in the present work. The influence of various joining parameters such as heat input, filler wire types on the growth of intermetallic phase layer thickness and corresponding joint strength are analysed and reported subsequently.

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Section: Gas Metal Arc Based Joiningmentioning

confidence: 99%

Laser and Gas Metal Arc Based Dissimilar Joining of Automotive Aluminium Alloys and Steel Sheets - A Review

Das

Bang

2018

Journal of Welding and Joining

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“…More recently, non-coated steel [27] and aluminized steel [17,28,29] were adopted for dissimilar metal joining rather than galvanized steel. The fluxless joining process is almost impossible for non-coated steel due to insufficient wetting, as explained above.…”

Section: Introductionmentioning

confidence: 99%

Joining Al 5052 alloy to aluminized steel sheet using cold metal transfer process

Kang

Kim

2015

Materials & Design

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“…In other words, residual solder paste would remain in the solder interconnects if thermal aging or heat treatment is not further introduced after the fabrication process. It is likely that a few micrometer thick IMC layer could improve the bonding strength [12], [13] or even the thermal-mechanical reliability performance of solder interconnects due to better weldability [14]. However, as the IMC thickness grows up to a certain level, the shear strength of solder interconnects would be significantly downgraded [12], [13], [15]- [17] because of the hard and brittle properties of IMC.…”

mentioning

confidence: 98%

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

Cheng

Tsai

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper investigates the solder interconnect reliability of a high-density 3-D chip-on-chip technology under an accelerated thermal cycling (ATC) test condition through finite element (FE) modeling and experimental validation. The fabrication of the 3-D chip-on-chip technology is accomplished with a two-step gap control bonding process to minimize the solder squeezing phenomenon. The alternative goal of this paper is placed on the influences of underfill on the interconnect failure mechanism and reliability. With the calculated plastic strain, the thermal fatigue life of the most critical solder interconnect can be estimated through an empirical Coffin-Manson fatigue life prediction model. The effectiveness of the proposed FE modeling is demonstrated through ATC tests. Finally, to identify the parameters most affecting the lead-free solder interconnect reliability, both parametric FE analysis and a simulation-based experimental design scheme based on a response surface methodology are carried out with the validated FE model. Both the numerical and experimental results that underfill can not only change the interconnect failure mechanism from an interfacial crack between the Al pad and the copper (Cu) layer of the under bump metallurgy to a cohesive solder failure, but also greatly improve the solder interconnect thermal fatigue life by as much as 2.5 times. Furthermore, the experimental design demonstrates that both the Young's modulus of intermetallic compound and thermal expansion coefficient of underfill are identified as the parameters most affecting the solder interconnect reliability of the 3-D chip-on-chip technology. Index Terms-3-D chip-on-chip technology, accelerated thermal cycling (ATC), finite element (FE) modeling, interconnect reliability, intermetallic compound (IMC), underfill.

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Joining of Steel to Aluminum Alloy by AC Pulse MIG Welding

Cited by 46 publications

References 8 publications

Laser and Gas Metal Arc Based Dissimilar Joining of Automotive Aluminium Alloys and Steel Sheets - A Review

Laser and Gas Metal Arc Based Dissimilar Joining of Automotive Aluminium Alloys and Steel Sheets - A Review

Joining Al 5052 alloy to aluminized steel sheet using cold metal transfer process

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

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