Joining SiC‐Based Ceramics and Composites with Preceramic Polymers

Colombo, Paolo; Donato, A.; Riccardi, B.; Woltersdorf, J.; Pippel, Eckhard; Silberglitt, Richard; Danko, Gene A.

doi:10.1002/9781118406014.ch29

Cited by 16 publications

(6 citation statements)

References 14 publications

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“…= 196 mm ; height : 80 mm) by the so-called pseudo-HIP technique, has been recently reported [15]. Also, parts of large size could be produced by combining the fabrication of subelements by SI/HPS with a suitable joining technique based on brazing alloys (such as the Si-16 Ti or Si-18 Cr eutectic alloys with melting point of 1330 and 1305°C, respectively [66], preceramic polymers [67,68], carbonaceous paste/liquid Si infiltration [69] or slurry deposition/HPS [70,71].…”

Section: Ceramic Processing Route : the Si/hps Processmentioning

confidence: 99%

Processing of Non-Oxide Ceramic Matrix Composites: An Overview

Naslain

2006

Advances in Science and Technology

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Ceramic matrix composites (CMCs) comprise a fiber reinforcement embedded in a ceramic matrix, the two main constituents being bonded through an interphase, which is a thin layer of a compliant material with a low shear stress, arresting and deflecting the matrix microcracks formed under load. Non-oxide CMCs, such as C/C ; C/SiC or SiC/SiC, are fabricated from a suitable precursor of the matrix, following a gaseous (CVI-process), a liquid (PIP and RMI processes) or a slurry (SI-HPS) routes. Each of these routes is briefly depicted focusing on fundamental aspects and its advantages and drawbacks discussed. Possible extensions of the processes to new composites are suggested. Finally, a comparison of these techniques, in terms of processability and composites properties is presented.

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Section: Ceramic Processing Route : the Si/hps Processmentioning

confidence: 99%

Processing of Non-Oxide Ceramic Matrix Composites: An Overview

Naslain

2006

Advances in Science and Technology

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“…Joining is an alternative route. Various joining techniques have been investigated: active metal brazing, reaction bonding, diffusion bonding, transient‐liquid‐phase joining, laser joining with oxides solders, joining by preceramic polymers or glass, etc. Among these joining methods, the technology of joining with glass or glass‐ceramics possesses the dominant trait because the glass composition can be easily adjusted to make the CTE match with that of the substrate.…”

Section: Introductionmentioning

confidence: 99%

Joining of Sintered Silicon Carbide Ceramics Using Sodium Borosilicate Glass as the Solder

Luo

Jiang

Zhang

et al. 2012

Int J Applied Ceramic Tech

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Sodium borosilicate glass powder with the Si:B:Na molar ration of 53:44:6 has been developed and used as the solder to join sintered SiC ceramics. The coefficient of thermal expansion of the glass matches the silicon carbide substrate well at low temperature, and the wettability of the solder on SiC substrate becomes excellent above 1150°C. The 4-point bending strength of the joint reaches 218 ± 23 MPa at room temperature and the joint strength at 400°C can be kept at 154 ± 35 MPa. The microstructure, compositions, and interfacial properties were studied. Results showed that a good adhesion between SiC substrate and the solder layer was achieved. *

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“…In reaction bonding carbonaceous mixtures are reacted with silicon carbide 9,18 or silicon 19,20 to form silicon carbide. Different types of polymers 21,22 have also been used for SiC bonding with limited success. Active brazing with the Ag-Cu-Ti alloy had been used to join SiC 23 and had shown good success.…”

Section: Introductionmentioning

confidence: 99%

Integration Technologies for Silicon Carbide‐Based Ceramics for Micro‐Electro‐Mechanical Systems‐Lean Direct Injector Fuel Injector Applications

Halbig

Singh

Tsuda

2012

Int J Applied Ceramic Tech

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Advanced joining approaches are critically needed for the fabrication and integration of silicon carbide-based micro-electromechanical systems lean direct fuel injectors for jet engines. Diffusion bonding of silicon carbide with titanium interlayers offers advantages such as uniform application/surface coverage and no flow of the interlayer or the reaction formed phases during joint processing. The resulting joints were uniform, stable, leak free, and had high strength. Titanium interlayers with 10 and 20 lm thicknesses were obtained from physical vapor deposition (PVD) and pure metallic foils. The effects of the interlayer type and thickness and processing time on the resultant microstructures were investigated. The joints and their reaction-formed phases were analyzed with electron microprobe analysis and scanning electron microscopy coupled with energy-dispersive spectroscopy, ultrasonic immersion nondestructive evaluation method, and transmission electron microscopy. For the physical vapor deposition Ti interlayers, the 10 lm coating gave the best results yielding a joint that did not have intermediate phases or microcracking. For the Ti foil interlayers, the joint processed with a 4 h-hold time had more stable phases and less microcracking than those with 1 and 2 h-hold times. The average tensile strength of the diffusion bonds was 14.2 MPa which was 2-3 times higher than the application requirements. The diffusion bonding approach was shown to meet the requirements for SiC-based fuel injector fabrication. *michael.c.halbig@nasa.gov

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Joining SiC‐Based Ceramics and Composites with Preceramic Polymers

Cited by 16 publications

References 14 publications

Processing of Non-Oxide Ceramic Matrix Composites: An Overview

Processing of Non-Oxide Ceramic Matrix Composites: An Overview

Joining of Sintered Silicon Carbide Ceramics Using Sodium Borosilicate Glass as the Solder

Integration Technologies for Silicon Carbide‐Based Ceramics for Micro‐Electro‐Mechanical Systems‐Lean Direct Injector Fuel Injector Applications

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