Joining silicon nitride to itself and to metals

Abstract

This article reviews the progress that has been made in developing and applying joining techniques for Si3N4 and discusses our understanding of the influence of process selection on the materials science of the formation and properties of joints. High-performance Si 3 N 4 joints can be produced, but it is clear that much work remains to be done before the use of such joints in hot-stressed applications can be disregarded as a problem.

Microstructural and mechanical evaluation of a Cu-based active braze alloy to join silicon nitride ceramics

“…This is qualitatively consistent with the literature studies according to which formation of complex Ti-Si-Cu-N compound layers is observed in silicon nitride joints brazed using Ag-Cu-Ti brazes. 2 There is no evidence of interfacial de-cohesion in the joint region.…”

“…[1][2][3][4] Other notable fillers include Ag-Cu-In and Ag-Cu-Sn containing Ti. Besides Ti, active elements such as Hf, Zr, Nb and Ta also have been evaluated for joining Si 3 N 4 .…”

Ceramic-metal interfaces and the spreading of reactive liquids

“…An example of rapid spreading kinetics in the spreading data for 1.2 g samples ofcopper-titanium alloys on alumina at 1,120°C. 87 tively:19,43 …”

Production, Characterization, and Mechanical Evaluation of Dissimilar Metal/Ceramic Joints

“…The technological advantages of diffusion bonding are low deformation which enables parts to be joined with little distortion, the ability to join large areas, the applicability of diffusion bonded joints at high service temperatures, and the www.intechopen.com possibilities for joining materials in a none conventional way (Dunford & Wisbey, 1993). However, the major disadvantages of diffusion bonding are high capital costs, and the restricted joint geometries that can be produced (Peteves et al, 1996). In addition, specific problems exist when applying diffusion bonding to Si 3 N 4 .…”