“…Von Neumann architecture created in the mid-1940s by John von Neumann has gained great success in the modern information society . However, the shared bus can result in limited throughput between the central processing unit (CPU) and memory, which is called the von Neumann bottleneck, affecting the efficiency and overall performance of the system. − Thus, many efforts have been devoted to the exploration of devices enabling computing paradigms such as in-memory computing and numerous computing to meet the growing demands of computing performance with high throughput and high energy efficiency. − Meanwhile, devices are moving toward the trend of high integration, light weight, multifunction, low voltage, and low energy cost. − Besides, the coming era of wearable and portable electronics has pushed the quest for devices with intriguing features such as mechanical flexibility, conformal characteristics, and self-powered capacity. ,,, Therefore, it is urgently desired to explore intriguing devices based on advanced materials or innovative architectures which go beyond the current Si-CMOS technologies. ,,− With fascinating nonvolatile features and low power consumption, the devices based on emerging 2D materials integrated with ferroelectrics enable innovative functions such as in-memory computing and ultralow-voltage operation, which is promising in addressing the above challenges.…”