Kesan Penuaan Sesuhu terhadap Sifat Mikro Kekerasan Pempaterian Sn-Ag-Cu/CNT/Cu menggunakan Pelekukan Nano

Ismail, Norliza; Jalar, Azman; Bakar, Maria Abu; Ismail, Roslina; Safee, Nur Shafiqa; Ismail, Ahmad Ghadafi; Ibrahim, Najib Saedi

doi:10.17576/jsm-2019-4806-14

Cited by 6 publications

(4 citation statements)

References 15 publications

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“…This is due to the indentation size covered both phase area which is near eutectic and β-Sn primary phase. This finding agrees with the other studies, reported that the addition of CNT have a significant effect towards increasing the hardness of solder alloys [28,29,30]. Figure 10 shows the reduced modulus of SAC305 and SAC305 doped CNT solder joint.…”

Section: Resultssupporting

confidence: 91%

Localized Micromechanical Properties of Fine-Pitch Sac305 Doped Carbon Nanotube Solder Joints

Ismail,

Zulkifl,

Atiqah

2022

Jurnal Teknologi

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The addition of carbon nanotube (CNT) to the solder alloy has gained the attention due to its beneficially improve the mechanical properties of the solder alloy. Because of the miniaturization progress of electronic component, micromechanical properties of solder joint need to be focused instead of conventional mechanical properties. In this study, micromechanical properties, and deformation behaviour of SAC305 solder joints with the different CNT doping (weight percentage of 0.01, 0.02, 0.03 and 0.04) were investigated. Localized micromechanical properties included hardness, reduced modulus and stress exponent were determined via nanoindentation approach. Microstructural analysis was performed via optical microscope and field emission scanning microscope (FESEM). Doping of CNT in the SAC305 solder matrix changed the microstructure phase distribution. It was found that, doping of CNT, increase the near eutectic phase and decrease the primary b-Sn phase area. Furthermore, hardness values of SAC305 solder joint increased with increasing of CNT doping weight percentage. Hardness values of SAC305 solder joint increase about ~7 - 40% with the doping of CNT from 0.01 wt. % to 0.04 wt. %. However, localized reduced modulus and stress exponent show random values and no correlated trend with CNT doping were observed. Random values trend of stress exponent revealed that, SAC305 solder joint with the CNT doped involved the combination of deformation mechanism. This is due to the response of phase and CNT in the solder matrix to the localized indentation. In conclusion, a localized approach to hardness properties influenced by the CNT doping weight percentage.

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Section: Resultssupporting

confidence: 91%

Localized Micromechanical Properties of Fine-Pitch Sac305 Doped Carbon Nanotube Solder Joints

Ismail,

Zulkifl,

Atiqah

2022

Jurnal Teknologi

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“…In the study, they claimed release of heat rapidly during loading at high strain rates aided in the refinement of grains [24]. The hardness of a material determines its resistance to plastic deformation [25]. In a nanoindentation test, hardness is defined as the sample's ability to withstand the indenter as it penetrates the sample's surface when a load is applied [26].…”

Section: Resultsmentioning

confidence: 99%

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

Mohd Yusoff,

Jalar

2022

Jurnal Teknologi

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Sn-based solder alloys are commonly utilized in electronic packages as an interconnection. In this study, nanoindentation was used to explore the impact of thermomechanical processing on the micromechanical characteristics of Sn-0.7Cu solder alloy. Bar-shaped Sn-0.7Cu solder alloy was cut into 9 cubic-shaped samples with dimension of 6 mm (l) X 6 mm (w) X 10 mm (h). First, cubic-shaped Sn-0.7Cu solder alloys was heat-treated for 20 minutes at temperatures of 30°C, 90°C, and 150°C, followed by compression until the thickness reduced to 40% and 80% and quick quench in water medium. As a control, solder alloys without compression process are employed. The result shows that thermomechanical-processed samples with 80% thickness reduction have the least hardness changes along temperature increment. These values were 6.46 MPa (from 30℃ to 90℃) and 23.73 MPa (from 90℃ to 150℃), respectively. The smaller gap of values when temperature increased were obtained through formation of new recrystallize grains which also referred as grain refinemet. The reduced modulus for thermomehanical-procesed sample with 80% thickness reduction sample also showed the same trend as the hardness value. The value dropped from 56.22 GPa to 42.12 GPa before rising slightly to 48 GPa as the temperature increased. The change of reduced modulus values were lower when compared to control and thermomechanical-processed sample with 40% thickness reduction samples. The findings demonstrate that as the temperature rises, thermomechanical processing with an 80% thickness reduction stabilizes the micromechanical properties of the Sn-0.7Cu solder alloy.

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“…Hardness is the measurement of the resistance of a material to plastic deformation [12]. Definition of hardness in nanoindentation test refer to the resistance of sample to withstand the indenter as it penetrates the surface of sample when a load is applied.…”

Section: Maximum Depthmentioning

confidence: 99%

Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach

Yusoff

Bakar

Jalar

2022

J. Phys.: Conf. Ser.

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The relationship between a process and mechanical properties are important in understanding the behaviour of a material under certain conditions. This indicate that mechanical properties of the materials can be modified through certain processing. Hence, this paper investigates the effect of 60% thickness reduction of Sn-Cu alloy in thermomechanical treatment on the localized micromechanical properties. A bar-shape of Sn-Cu solder alloy is subjected to heat treatment at 30°C, 60°C, 90°C, 120°C and 150°C for 20 minutes, followed by 60% thickness reduction via compression process. Sample without compression process was used as control sample. Nanoindentation approach was used to characterize the localized micromechanical properties of the samples. The results show the hardness value for control samples reduced approximately 56%, from 181 MPa at 30°C to 79 MPa at 150°C. Reduced modulus of control sample has shown similar decreasing trend from 149 GPa at 30°C to 85 GPa at 150°C, approximately 43% changes. Lower changes in hardness and reduced modulus observed for thermomechanical treated sample approximately 20% and 18%, respectively. These findings show that thermomechanical treatment has given significant effect on the localized micromechanical properties of Sn-Cu solder alloy.

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Kesan Penuaan Sesuhu terhadap Sifat Mikro Kekerasan Pempaterian Sn-Ag-Cu/CNT/Cu menggunakan Pelekukan Nano

Cited by 6 publications

References 15 publications

Localized Micromechanical Properties of Fine-Pitch Sac305 Doped Carbon Nanotube Solder Joints

Localized Micromechanical Properties of Fine-Pitch Sac305 Doped Carbon Nanotube Solder Joints

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach

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