Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching

Oluokun, Oluwayimika Olasunkanmi; Otunniyi, Iyiola Olatunji

doi:10.1016/j.hydromet.2020.105320

Cited by 23 publications

(20 citation statements)

References 29 publications

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“…Rate constants (k) for different temperature were calculated by plotting Figure 8, and the Arrhenius plots using the rate constants over T −1 are presented in Figure 11, where the activation energy is found to be 23.8 kJ/mol. The activation energy is similar to the data reported in conventional studies [14,[42][43][44], which indicate that the leachate containing sulfuric acid with Cu 2+ is effective for Cu leaching. model is suitable for this PCBs' leaching.…”

Section: Figuresupporting

confidence: 86%

“…Studies on the leaching kinetics of Cu from PCBs were reported previously and investigations were carried out using HCl solution with Cl2 [42], NH4OH solution with H2O2 [14], HNO3 solution [43], and H2SO4 solution with Fe 3+ [44]. Activation energy values were calculated using shrinking core model [14,[42][43][44] and were determined to be 20.7-24.5 kJ/mol in HCl solution with Cl2 [42], 47.39 kJ/mol in NH4OH solution with H2O2 [14], 23.35 kJ/mol in HNO3 solution [43], and 14.87 kJ/mol in H2SO4 solution with Fe 3+ [44], respectively. The shrinking core model can be presented by [45] 1 − (1 − ) = ,…”

Section: Figurementioning

confidence: 99%

“…The value for x in the equations represents the fraction reacted and is obtained from the leaching efficiencies, while kr and kd are rate constants. Studies on the leaching kinetics of Cu from PCBs were reported previously and investigations were carried out using HCl solution with Cl 2 [42], NH 4 OH solution with H 2 O 2 [14], HNO 3 solution [43], and H 2 SO 4 solution with Fe 3+ [44]. Activation energy values were calculated using shrinking core model [14,[42][43][44] and were determined to be 20.7-24.5 kJ/mol in HCl solution with Cl 2 [42] [44], respectively.…”

Section: Figurementioning

confidence: 99%

“…The pretreatment processes such as soaking in NaOH solution [7] and microwave pyrolysis [8] and mineral processing processes [9] such as flotation [10] were investigated to enhance the dissolution efficiency of valuable metals from PCBs. Leaching processes of PCBs have been examined using hydrogen peroxide (H 2 O 2 ) [11][12][13][14], ammonia solution [10,[14][15][16], HNO 3 [16][17][18], halogen [16,17,19,20], glycine [12,13], and ionic liquid [21]. Bacterial leaching processes of PCBs have also been reported as environment-benign processes, where Phanerochaete chrysosporium [22], Acidithiobacillus ferrooxidans [23], Leptospirillum ferriphilum or its mixed culture Metals 2021, 11, 1369 2 of 11 with Acidithiobacillus ferrooxidans [24][25][26], and Frankia sp.…”

Section: Introductionmentioning

confidence: 99%

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Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Park

Eom

Yoo

et al. 2021

Metals

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In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu2+ and O2 is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial Cu2+ concentration, and pulp density were investigated to examine the dissolution behavior of Cu from PCBs in 1 mol/L sulfuric acid. The kinetic studies were performed using the obtained leaching data. The leaching rate of Cu from PCBs was found to be higher on addition of Cu2+ and O2 to the leachant in comparison with the addition of O2 or both Cu2+ and N2 in the leachant. The leaching efficiency of Cu was found to be increased with increasing agitation speed, temperature, O2 flow rate, and initial Cu2+ concentration and decreasing pulp density. The 96% of Cu leaching efficiency was obtained under the following conditions: sulfuric acid concentration, 1 mol/L; temperature, 90 °C; agitation speed, 600 rpm; pulp density, 1%; initial Cu2+ concentration, 10,000 mg/L; and O2 flow rate, 1000 cc/min. The leaching data and analyses indicate that the Cu leaching from PCBs followed the reaction-controlled model satisfactorily and determined that the activation energy was found to be 23.8 kJ/mol. Therefore, these results indicate that the sulfuric acid solution with Cu2+ and O2 as a mild leach medium without strong oxidants such as HNO3, H2O2, and Fe3+ is valid for Cu leaching from PCBs.

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Section: Figuresupporting

confidence: 86%

Section: Figurementioning

confidence: 99%

Section: Figurementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Park

Eom

Yoo

et al. 2021

Metals

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“…Different groups of lixiviants such as inorganic acid [30,31,33,38], organic acid [27,36] and alkaline reagents [36,[39][40][41], are used for metal leaching from e-waste. Recently, several reports were made with respect to REE and precious metals [26,37,[42][43][44].…”

Section: Chemical Leachingmentioning

confidence: 99%

A Review on Chemical versus Microbial Leaching of Electronic Wastes with Emphasis on Base Metals Dissolution

et al. 2021

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There is a growing interest in electronic wastes (e-wastes) recycling for metal recovery because the fast depletion of worldwide reserves for primary resources is gradually becoming a matter of concern. E-wastes contain metals with a concentration higher than that present in the primary ores, which renders them as an apt resource for metal recovery. Owing to such aspects, research is progressing well to address several issues related to e-waste recycling for metal recovery through both chemical and biological routes. Base metals, for example, Cu, Ni, Zn, Al, etc., can be easily leached out through the typical chemical (with higher kinetics) and microbial (with eco-friendly benefits) routes under ambient temperature conditions in contrast to other metals. This feature makes them the most suitable candidates to be targeted primarily for metal leaching from these waste streams. Hence, the current piece of review aims at providing updated information pertinent to e-waste recycling through chemical and microbial treatment methods. Individual process routes are compared and reviewed with focus on non-ferrous metal leaching (with particular emphasis on base metals dissolution) from some selected e-waste streams. Future outlooks are discussed on the suitability of these two important extractive metallurgical routes for e-waste recycling at a scale-up level along with concluding remarks.

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Mechanism and kinetics study on waste acid leaching from copper smelting dust

Cai,

Yu,

Lin

et al. 2024

Env Prog and Sustain Energy

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Copper smelters generate large amounts of copper smelting dust (CSD) that has a high recycling value because it contains about 20% copper. Waste acid can be used to leach CSD. Here, the effects of different temperatures, times and liquid–solid ratios on copper, iron and arsenic leaching rates were investigated. The optimal conditions were determined to be a temperature of 95°C, leaching time of 3 h, and liquid–solid ratio of 7:1. Under these condition, the leaching rate of copper reached 96.37%, and the copper ion concentration was 32.71 g/L. The leaching kinetics date revealed that the leaching of copper and iron was controlled by two different reaction models. The leaching of copper conformed to the Johnson–Mehl–Avrami (JMA) model and was diffusion controlled, and the reaction was rapid in the first 60 min. In contrast, leaching of iron was controlled by a chemical reaction. Copper and iron activation energies were 2.579 and 62.791 kJ/mol, respectively. These results show that CSD waste acid is can be used to dispose of arsenic‐containing hazardous waste in a green, sustainable, and ecologically method.

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Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching

Cited by 23 publications

References 29 publications

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

A Review on Chemical versus Microbial Leaching of Electronic Wastes with Emphasis on Base Metals Dissolution

Mechanism and kinetics study on waste acid leaching from copper smelting dust

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