Kinetic model of copper electrodeposition in sulfate solution containing trisodium citrate complexing agent

Heidari, G.; Khoie, S.M. Mousavi; Yousefi, Mehrdad; Ghasemifard, Mahdi

doi:10.1134/s1023193516050050

Cited by 7 publications

(8 citation statements)

References 28 publications

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“…The result is accordant with the two‐step reaction mechanism reported by Chassaing and Heidari [35,36] . Similarly, as shown in Figure 2a curve 2, the two‐step reduction peaks of En−Cu coordination ion are found at the potentials of −0.49 V and −0.81 V, respectively.…”

Section: Resultssupporting

confidence: 91%

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Jin

Yang

et al. 2022

ChemElectroChem

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In this work, an electronic copper electroplating bath with low copper ion concentration and preeminent throwing power in through hole (TH) thickening of the printed circuit board (PCB) was successfully developed. Based upon the weak alkaline bath containing the composite complexants of citrate (Cit) and ethylenediamine (En), their synergistic effects on the preeminent bath throwing power were carefully investigated and theoretically proved. The UV‐vis spectroscopy results illustrated that En exhibited a stronger coordination ability with Cu (II) ion than citrate, and the stoichiometric coordination ratio between En and Cu (II) ion was 2 : 1. The linear sweep voltammetry (LSV) results showed that the electro‐reduction peak potential of Cit−Cu coordination ion was −0.55 V (vs. Hg/HgO), whereas that of En−Cu ion was at a more negative potential of −0.82 V. The in situ Fourier transform infrared (FTIR) spectroscopy revealed that the adsorptions of the Cit−Cu and En−Cu coordination ions were potential dependent on the copper electrode. The Cit−Cu coordination ion was easily adsorbed at the interior sites of through holes with lower over‐potential to promote the growth of copper coating. Moreover, the En−Cu coordination ion adsorbed preferably on the surface and the edge of through hole for its higher electro‐reduction overpotential, to hinder the germinating of copper nuclear. The cross‐section observation of optical microscope proved that the throwing power of novel copper electroplating bath behaved surpassingly, up to 105.8 %.

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Section: Resultssupporting

confidence: 91%

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Jin

Yang

et al. 2022

ChemElectroChem

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“…Reviews by Kostenko et al [4] have shown that the cementite carbide phase has to network continuity in low carbon steels and heat treatments such as spherodization also affect the morphology and continuity of them. In recent years, many researches have been done in the field of three-dimensional metallography for studying the microstructure of steels [4][5][6][7][8][9][10][11][12][13][14][15][16][17]. This attention is due to the steels which are known as a widely used material in various industries like automotive, aerospace, construction, etc.…”

Section: Introductionmentioning

confidence: 99%

“…: (a) The geometric parameters of a particle, (b) an example of the image projection along the 90 °:[15].…”

mentioning

confidence: 99%

Heat treatment effects on three-dimensional morphology of chromium carbide in AISI D2 tool steel studied by serial sectioning method

Ghezghapan¹

2018

Preprint

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We developed a three-dimensional microstructure analysis system based on the manual serial sectioning method to evaluate the heat treatment effects on chromium carbide size and morphology in AISI D2 tool steel. Two heat treatment factors, austenitizing and tempering temperature were investigated. The results show that increasing in austenitizing temperature leads to further carbide precipitation after the tempering process and increasing in the tempering temperature causes precipitate smaller secondary carbides even more than the primary carbides.

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“…Al 2 O 3 , TiO 2 , porous polycarbonate, etc.) is developed primarily to control the morphology of nanostructures [58][59][60][61][62]. One of the main challenges, which limited the applicability of electrochemical method to fabricate highly-ordered nanowires, is that conventional direct current (DC) electrodeposition methods are suffering from practical difficulties related to producing a conductive self-assembled structure due to low conductivity of templates' materials [63][64][65][66][67][68][69][70][71][72][73][74][75][76].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Highly Ordered Sn Nanowires in Anodic Aluminum Oxide Templates by Using AC Electrochemical Method

Sm¹,

Saba²

2018

Preprint

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Sn and its nanostructures are one of the promising candidates to replace graphite in the anode of Lithium-ion batteries due to their higher capacity. One of the challenges, which limited the usage of Sn anodes for the Lithium-ion batteries, is Tin's high volumetric strain and its low cyclability. On the other hand, nanostructures show lower volume change during charge/discharge and as a result could address the cyclability issues. In this research, an alternating current (AC) electrochemical method is developed in order to facilitate the industrial scale production of Sn nanowires. The developed electrodeposition technique shows reliable controllability over chemical composition and crystalline structure of Sn nanowires. Also, the order structure of nanowires could be adjusted more accurately in comparison to conventional fabrication techniques. As a result, the Sn nanowires as well as Aluminum Oxide templates synthesized by using the developed electrochemical method are examined due to their morphology, chemical composition, and their crystalline structure in order to develop a practical relation between electrochemical composition of the solution and materials properties of Sn nanowires. The results show that the proposed electrodeposition method maintains a highly-ordered morphology as well as industrially acceptable controllability over crystalline structure of nanowires, which could be used to optimize the procedure for industrial applications due to low cost and simple experimental setup.

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Kinetic model of copper electrodeposition in sulfate solution containing trisodium citrate complexing agent

Cited by 7 publications

References 28 publications

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Heat treatment effects on three-dimensional morphology of chromium carbide in AISI D2 tool steel studied by serial sectioning method

Fabrication of Highly Ordered Sn Nanowires in Anodic Aluminum Oxide Templates by Using AC Electrochemical Method

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