Ladder shape micro channels employed high performance micro cooling system for ULSI

Brinda, R.; Daniel, R. Joseph; Sumangala, K.

doi:10.1016/j.ijheatmasstransfer.2012.03.044

Cited by 16 publications

(4 citation statements)

References 13 publications

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“…Researchers in the past few decades worked to enhance the thermal characteristics of the MCHS designs by employing various techniques such as altering the channel geometry, introducing different working fluids, and changing the flow behaviour [6][7][8][9][10][11][12][13][14][15]. Many employed experimental methods to enhance thermal characteristics, such as Reyes et al, who experimentally studied thermal enhancement and pressure drop in conventional MCHS with tip clearance and compared the results with those of a reference geometry having conventional rectangular characteristics [6].…”

Section: Introductionmentioning

confidence: 99%

“…Their study suggested that strategic placement of the inlet and outlet in a heat sink for optimal thermal absorption can significantly improve its performance. Brinda et al proposed a ladder-shaped microchannel with two parallel rectangular channels connected with one or more link channels [14]. The authors concluded that large disturbances in the flow, fluid mixing, and change in flow direction contribute to enhanced heat transfer.…”

Section: Introductionmentioning

confidence: 99%

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Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations

Memon¹,

Cheema²,

Kim³

et al. 2020

Energies

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Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat. Recent advancements in manufacturing techniques, such as additive manufacturing, have made the modification of the microchannel heat sink geometry possible well beyond the conventional rectangular model to improve the cooling capacity of these devices. One such modification in microchannel geometry includes the introduction of secondary flow channels in the walls between adjacent mainstream microchannels. The present study computationally models secondary flow channels in regular trapezoidal and parallel orientations for fluid circulation through the microchannel walls in a heat sink design. The heat sink is made of silicon wafer, and water is used as the circulating fluid in this study. Continuity, momentum, and energy equations are solved for the fluid flow through the regular trapezoidal secondary flow and parallel secondary flow designs in the heat sink with I-type, C-type, and Z-type inlet–outlet configurations. Plots of velocity contours show that I-type geometry creates optimal flow disruption in the heat sink. Therefore, for this design, the pressure drop and base plate temperatures are plotted for a volumetric flow rate range, and corresponding contour plots are obtained. The results are compared with corresponding trends for the conventional rectangular microchannel design, and associated trends are explained. The study suggests that the flow phenomena such as flow impingement onto the microchannel walls and formation of vortices inside the secondary flow passages coupled with an increase in heat transfer area due to secondary flow passages may significantly improve the heat sink performance.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations

Memon¹,

Cheema²,

Kim³

et al. 2020

Energies

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“…Bosi et al [4] designed a series of MC modules with different channel separation configurations to study the cooling phenomenon of a silicon pixel detector system. In addition, Brinda et al [5], in their study, propose a series of MC in a stepped form with a rectangular cross-section to increase the area of the walls, which decreases the thermal resistance and increases the heat transfer coefficient.…”

Section: Introductionmentioning

confidence: 99%

CFD Modeling of Microchannels Cooling for Electronic Microdevices

Fábregas

Santamaria

Buelvas

et al. 2022

IIUMEJ

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A simulation of the cooling of electronic devices was carried out by means of microchannels, using water as a coolant to dissipate the heat generated from a computer processor, and thus stabilize its optimum operating temperature. For the development of this study, computational fluid mechanics modeling was established in order to determine the temperature profiles, pressure profiles, and velocity behavior of the working fluid in the microchannel. In the results of the study, the operating temperatures of the computer processor were obtained, in the ranges of 303 K to 307 K, with fluid velocities in the microchannels of 5 m/s, a pressure drop of 633.7 kPa, and a factor of safety of the design of the microchannel of 15. From the results, the improvement of the heat transfer in a cooling system of electronic devices was evidenced when using a coolant as a working fluid compared to the cooling by forced air flow traditional. ABSTRAK: Simulasi penyejukan alatan elektronik telah dibina menggunakan saluran mikro, di samping air sebagai agen penyejuk bagi menghilangkan haba yang terhasil dari pemproses komputer, dan penstabil pada suhu operasi optimum. Kajian ini mengenai model komputasi mekanik bendalir bagi menentukan profil suhu, profil tekanan, dan halaju perubahan bendalir dalam saluran mikro. Dapatan kajian menunjukkan suhu operasi pemproses komputer adalah pada julat suhu 303 K sehingga 307 K, dengan halaju bendalir dalam saluran mikro adalah pada kelajuan 5 m/s, penurunan tekanan sebanyak 633.7 kPa, dan faktor keselamatan 15 bagi reka bentuk saluran mikro. Ini menunjukkan terdapat kenaikan pemindahan haba bagi sistem penyejukan alatan elektronik ini, terutama apabila cecair digunakan sebagai penyejuk haba berbanding kaedah tradisi iaitu dengan mengguna pakai aliran udara sebagai agen penyejuk.

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“…The circular cross section gives the uniform flow distribution among all the channels and it can be manufactured by using Low Temperature Cofired Ceramic (LTCC) technology. Brinda et al (2012) presented ladder shape heat sink as the effective one. The effect of geometrical parameters and their shape on conjugate heat transfer was further extended by comparison of the rectangle, trapezoidal and triangular geometrical section.…”

Section: Introductionmentioning

confidence: 99%

Effect of Different Shapes on Characteristics of Conjugate Heat Transfer of Micro Channel Heat Sink

Kanor¹,

Manimaran²

2016

Frontiers in Heat and Mass Transfer

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One of the effective liquid cooling techniques for microelectronic devices is attaching micro channel heat sink to the inactive side of chip. A micro channel heat sink is a device that decreases temperature by flowing coolant through micro channels. The present study focuses on the conjugate heat transfer analyses for different cross-sections (trapezoidal, hexagonal, octagonal and circular).After present study is validated with the published result in the literature, the comparative study of parallel and counter flow configuration is performed. Different geometries are modeled using CATIA V5 software and simulated in ANSYS Fluent R14. From these CFD simulations, preferred configuration of parallel-flow or counter-flow is chosen based on maximum possible heat transfer for effective cooling. The focus on the analyses is to improve the heat transfer rate by either decreasing the chip wall (bottom wall) temperature or the decrease in overall thermal resistance.

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Ladder shape micro channels employed high performance micro cooling system for ULSI

Cited by 16 publications

References 13 publications

Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations

Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations

CFD Modeling of Microchannels Cooling for Electronic Microdevices

Effect of Different Shapes on Characteristics of Conjugate Heat Transfer of Micro Channel Heat Sink

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