Laminar Film Condensation on a Finite Horizontal Surface

Nimmo, B.; Leppert, G.

doi:10.1615/ihtc4.1350

Cited by 27 publications

(12 citation statements)

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“…Thereafter, Shigechi era/. (1990) studied the same problem and reported that the calculated heat transfer coefficient was about 28% higher than theexperimental result ofNimmo and Leppert (1970).…”

Section: Introductionmentioning

confidence: 93%

Laminar Film Condensation on a Finite-Size Horizontal Wavy Disk With Suction at the Wall

Li¹,

Hsu²

2000

Chemical Engineering Communications

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The problem of two-dimensional, steady-state film condensation on a finite-size, isothermal, horizontal, wavy disk facing upward with suction at the wall is studied theoretically. In the present study, the minimum film thickness at the edge of the disk is determined by employing the concept of minimum mechanical energy inherited in the condensate flow rate. In addition to parameters Pr, Ja and Ra, it is found that the wavelength and the amplitude of the wave and the suction at the wall play important roles in determination of the film thickness and the heat transfer coefficient.

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Section: Introductionmentioning

confidence: 93%

Laminar Film Condensation on a Finite-Size Horizontal Wavy Disk With Suction at the Wall

Li¹,

Hsu²

2000

Chemical Engineering Communications

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“…The following heat transfer coefficient can be obtained from his model: During the years the Nusselt-model had been refined for cases with horizontal surfaces as well. Nimmo and Leppert [11] assumed that condensate flow on the top of a horizontal plate depends on the hydrostatic pressure gradient caused by the changes in the film, originated from the center to the edge of the horizontal plate. Their model incorporates a correction on the one-fourth power, also highlighted by Chiou and Chang [12].…”

Section: Filmwise Condensation Theory For Horizontal Platesmentioning

confidence: 99%

Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

et al. 2014

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The paper presents a method for investigating heat transfer during a specific reflow soldering method, Vapour Phase Soldering (VPS), where a horizontal Printed Circuit Board (PCB) is heated in vapour medium. The paper presents refined descriptions of filmwise condensation which were investigated and adjusted for the VPS process. The results show a proper and fast approximation of measurements. The dependence of the PCB characteristic length is also investigated. List of symbolsT Temperature, K Q Thermal energy, h Heat transfer coefficient, W/m 2 K A Body surface, m 2 t Time, s L Characteristic length, m H Second lateral dimension of PCB, m T Thickness of the PCB, m A Surface, m 2 k Thermal conductivity, W/m K hlv Latent heat of vaporization, kJ/kg q Density, kg/m 3 a Inclination angle,°g Gravitational constant, m/s 2 l Dynamic viscosity, kg/m s Nu Nusselt number, dimensionless Ra Rayleigh number, dimensionless

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“…sation on the upper surface of a horizontal plate was first studied by Nimmo and Leppert [11,12]. However, in their analysis, the thickness of the condensate layer at the edge of the plate was either assigned an assumed value or was specified using a particular boundary condition.…”

Section: Introductionmentioning

confidence: 99%

Laminar film condensation on a horizontal wavy plate embedded in a porous medium

Chang¹

2008

International Journal of Thermal Sciences

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Laminar Film Condensation on a Finite Horizontal Surface

Cited by 27 publications

References 0 publications

Laminar Film Condensation on a Finite-Size Horizontal Wavy Disk With Suction at the Wall

Laminar Film Condensation on a Finite-Size Horizontal Wavy Disk With Suction at the Wall

Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

Laminar film condensation on a horizontal wavy plate embedded in a porous medium

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