Laminated fabrication of 3D micro-electrode based on WEDM and thermal diffusion welding

Xu, Bin; Lei, Jianguo; Cheng, Rong; Ruan, Shuangchen; Wang, Zhenlong

doi:10.1016/j.jmatprotec.2015.02.005

Cited by 38 publications

(16 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This welding method has been widely applied in the fields of aviation, aerospace, instruments and electronics because it results in compatible chemical components and perfect properties at the joints [ 1 , 2 ]. So far, numerous theoretical and experimental investigations have been performed on the diffusion welding [ 3 , 4 , 5 , 6 , 7 , 8 ]. However, much of these studies focused on the microstructures and properties of the joints, and little literatures related to the diffusion mechanisms and behaviors of the interface have been found because the atomic diffusion during the welding is difficult to be observed by means of conventional methods.…”

Section: Introductionmentioning

confidence: 99%

Atomistic Investigation on Diffusion Welding between Stainless Steel and Pure Ni Based on Molecular Dynamics Simulation

Zhang

Jiang

2018

Materials

View full text Add to dashboard Cite

Based on molecular dynamics (MD) simulation, the behaviors and mechanisms of diffusion welding between 304 stainless steel (304 SS) and pure Ni were investigated in the present study. The results show that surface roughness has a significant influence on the diffusion behaviors of atoms during diffusion welding between two different materials, and it is suggested that the rough surface should be set on the pure Ni rather than the 304 SS during the diffusion welding between them. Temperature plays an important role in the interface diffusion. With the increase of temperature, the number of atoms diffusing into the opposite side increases and the diffusion distances increase as well. As a consequence, the diffusion welding should be performed at a suitably elevated temperature. The influence of vertical pressure on the diffusion bonding between the two materials includes two aspects. One is to increase the contact area via deforming the asperities or grooves at the interface, which provides more opportunities for the diffusion between the two materials. The other is to reduce the mobility of atoms within a lattice. As a consequence, the pressure effect is smaller than temperature effect during diffusion welding between 304 SS and pure Ni.

show abstract

Section: Introductionmentioning

confidence: 99%

Atomistic Investigation on Diffusion Welding between Stainless Steel and Pure Ni Based on Molecular Dynamics Simulation

Zhang

Jiang

2018

Materials

View full text Add to dashboard Cite

show abstract

“…The working fluid used in the micro-EDM process was deionized water. According to the previous study [ 26 , 27 , 28 ], the machining conditions are selected to prepare the 3D microelectrodes and microstructures, as listed in Table 1 .…”

Section: Methodsmentioning

confidence: 99%

“…There was physical contact without metallurgical reaction between the foils. To improve the machining efficiency, based on the laminated object manufacturing (LOM), Xu et al [ 26 ] fabricated a laminated 3D microelectrode with a complicated contour and shape via combining wire electrical discharge machining (WEDM) and thermal diffusion welding, and used the 3D microelectrode stacked by Cu foils to manufacture 3D microstructures by an up-and-down reciprocating machining method. To improve the machining accuracy, Xu et al [ 27 ] prepared a 3D queue microelectrode by WEDM and vacuum pressure thermal diffusion welding, and applied it in micro-EDM to machine 3D microstructures.…”

Section: Introductionmentioning

confidence: 99%

Surface Quality Improvement of 3D Microstructures Fabricated by Micro-EDM with a Composite 3D Microelectrode

Lei

Jiang

et al. 2020

Micromachines

Self Cite

View full text Add to dashboard Cite

Three-dimensional (3D) microelectrodes used for processing 3D microstructures in micro-electrical discharge machining (micro-EDM) can be readily prepared by laminated object manufacturing (LOM). However, the microelectrode surface always appears with steps due to the theoretical error of LOM, significantly reducing the surface quality of 3D microstructures machined by micro-EDM with the microelectrode. To address the problem above, this paper proposes a filling method to fabricate a composite 3D microelectrode and applies it in micro-EDM for processing 3D microstructures without steps. The effect of bonding temperature and Sn film thickness on the steps is investigated in detail. Meanwhile, the distribution of Cu and Sn elements in the matrix and the steps is analyzed by the energy dispersive X-ray spectrometer. Experimental results show that when the Sn layer thickness on the interface is 8 μm, 15 h after heat preservation under 950 °C, the composite 3D microelectrodes without the steps on the surface were successfully fabricated, while Sn and Cu elements were evenly distributed in the microelectrodes. Finally, the composite 3D microelectrodes were applied in micro-EDM. Furthermore, 3D microstructures without steps on the surface were obtained. This study verifies the feasibility of machining 3D microstructures without steps by micro-EDM with a composite 3D microelectrode fabricated via the proposed method.

show abstract

“…Functional-surface microstructures possess the advantages of improved lubrication conditions, reduced friction, and enhanced heat dissipation performance, and have signi cant application value for practical industrial production [1][2][3]. Micro-EDM is one of the most common processes for fabricating functionalsurface microstructures.…”

Section: Introductionmentioning

confidence: 99%

Study on Recast Layer Thickness of Microstructures Machined in micro-EDM with Different Electrodes

Chen¹,

Lian²,

Wu³

et al. 2021

Preprint

Self Cite

View full text Add to dashboard Cite

Functional-surface microstructures are widely used in industrial practice. During the fabrication of microstructures in micro-electrical discharge machining (micro-EDM), the thermal and physical characteristics of both workpieces and electrode materials at room temperature and high temperatures have an important influence on surface quality and distribution of recast layer. In order to study the influence of different electrode material characteristics on the surface integrity of microstructures machined using micro-EDM, red copper, brass, copper-tungsten and tungsten electrode were used to perform micro-EDM on both Ti-6Al-4V alloy and 304 stainless steel. In the experiment, electrode with groove arrays featuring high copying accuracy and surface quality was designed to carry out powder mixed electrical discharge machining (PMEDM) on Ti-6Al-4V alloy, and the machining results were evaluated based on four indicators: microstructure morphology, tool electrode wear (TEW), material removal rate (MRR), and recast layer thickness (RLT). Simultaneously, the surface morphology and recast layer thickness changes of 304 stainless steel workpieces machined using the above four types of electrodes, using both normal polarity and negative polarity micro-EDM were quantitatively analyzed. The results showed that copper-tungsten electrode is recommended to machine Ti-6Al-4V alloy because it has a smaller TEW (139 µm), the highest MRR (255.39 mm3/min), and a thinner recast layer thickness (3.35 µm). This was followed by copper electrode, which featured good machining performance and machinability. When machining 304 stainless steel with negative polarity, the TEW of copper electrode and tungsten electrode was the smallest, and the thickness of recast layer was able to be effectively reduced to about 3 µm.

show abstract

Laminated fabrication of 3D micro-electrode based on WEDM and thermal diffusion welding

Cited by 38 publications

References 13 publications

Atomistic Investigation on Diffusion Welding between Stainless Steel and Pure Ni Based on Molecular Dynamics Simulation

Atomistic Investigation on Diffusion Welding between Stainless Steel and Pure Ni Based on Molecular Dynamics Simulation

Surface Quality Improvement of 3D Microstructures Fabricated by Micro-EDM with a Composite 3D Microelectrode

Study on Recast Layer Thickness of Microstructures Machined in micro-EDM with Different Electrodes

Contact Info

Product

Resources

About