Lapping performance of mixed-size agglomerated diamond abrasives in fixed abrasives pads

Niu, Fengli; Wang, Kerong; Sun, Tao; Zhou, Piao; Hu, Weidong; Zhu, Yongwei

doi:10.1016/j.diamond.2021.108499

Cited by 22 publications

(5 citation statements)

References 22 publications

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“…However, single crystal abrasives are processed for a period of time, and the passivation phenomenon occurs at the edges, which results in a decrease in the machinability of single crystal abrasives and deterioration of the processing quality of the workpiece. To ensure that the abrasive in the lapping and polishing process to maintain the stability of the processing is particularly important, for this reason, the researchers have developed and prepared the polycrystalline aggregates abrasives [14][15][16]. Zhu et al [17] made single crystal diamond micro powders into polycrystalline diamond abrasives with larger particle sizes through low-temperature ceramic bonds, and compared the lapping properties of single crystal and polycrystalline diamond abrasives.…”

Section: Introductionmentioning

confidence: 99%

Influence of Binding Agent on the Cutting Performance and Wear Characteristics of Catalytic Composite Abrasive Cluster

Ding,

Wang,

Huang

et al. 2024

Preprint

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Section: Introductionmentioning

confidence: 99%

Influence of Binding Agent on the Cutting Performance and Wear Characteristics of Catalytic Composite Abrasive Cluster

Ding,

Wang,

Huang

et al. 2024

Preprint

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“…The main reason for this difference is the different fracture toughness, Young’s modulus, and surface energy. Niu [ 21 ] made a FADA gasket using the mixed particle size agglomerated diamond (MAD) abrasive, which is a combination of ultra-fine diamond particles and coarser diamond particles. The significant grinding feature of MAD abrasive particles is that coarser diamond abrasive particles mainly increase grinding efficiency, while ultra-fine diamond abrasive particles improve the surface’s quality.…”

Section: Introductionmentioning

confidence: 99%

Research on the Preparation and Application of Fixed-Abrasive Tools Based on Solid-Phase Reactions for Sapphire Wafer Lapping and Polishing

Cao,

Zhou,

Wang

et al. 2023

Micromachines

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Single-crystal sapphire specimen (α-Al2O3) have been widely applied in the semiconductor industry, microelectronics, and so on. In order to shorten the production time and improve the processing efficiency of sapphire processing, an integrated fixed-abrasive tool (FAT) based on solid-phase reactions is proposed in this article. The optimal FAT composition is determined using a preliminary experiment and orthogonal experiments. The mass fraction of the abrasives is chosen as 55 wt%, and the mass ratio of SiO2/Cr2O3 is 2. Surface roughness Ra decreased from 580.4 ± 52.7 nm to 8.1 ± 0.7 nm after 150 min, and the average material removal rate was 14.3 ± 1.2 nm/min using the prepared FAT. Furthermore, FAT processing combined with chemical mechanical polishing (CMP) was shortened by 1.5 h compared to the traditional sapphire production process in obtaining undamaged sapphire surfaces with a roughness of Ra < 0.4 nm, which may have the potential to take the place of the fine lapping and rough polishing process.

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“…Wang Xu et al [14] used the fixed abrasive tool to process silicon carbide and deduced the removal function model of the multi-pellet polishing disc. Niu et al [15] proposed a method to process BK7 glass by a vitrified bondfixed abrasive tool formed by the combination of a precision diamond abrasive and a coarse diamond abrasive. Feng [16][17][18] proposed a Polyvinyl alcohol/phenolic resin (PVA/PF) composite sol-gel tool to process SiC wafers.…”

Section: Introductionmentioning

confidence: 99%

The Preparation and Performance Analysis of a Cr2O3 Gel Abrasive Tool for Sapphire Substrate Polishing

et al. 2022

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In order to solve the problem of the agglomeration of abrasives in traditional hot-pressing abrasive tools, this paper proposes a chromium oxide (Cr2O3) gel abrasive tool with a polyacrylamide gel and a polyimide resin as the bonding agent. The effects of the dispersant and slurry pH on slurry viscosity and the effects of different sintering temperatures on the properties of the abrasives tool were explored. The influence of abrasive tools on the friction coefficient at different sintering temperatures was compared through friction and wear experiments. A comparison experiment of sapphire substrate polishing was carried out to compare the processing effect of the hot-pressing abrasive tool and the gel abrasive tool on the workpiece. The experimental results show that, when the pH value of the slurry is between 8–9 and the mass fraction of the dispersant is 1.5 wt%, the viscosity of the slurry is the lowest. When the sintering temperature is 350 °C, the tensile and flexural strengths of the abrasive tool reach 96 MPa and 42 MPa, and the hardness reaches 72 HRF. In the friction wear test, the friction coefficient is the most stable, and the wear rate of the abrasive tool is the lowest. In the polishing experiment, the gel abrasive tool performs better than the hot-pressing abrasive tool. After processing using the gel abrasive tool, the average surface roughness Ra reaches 2.69 nm, and the flatness PV reaches 0.65 μm; after CMP, the surface roughness Ra reaches 0.67 nm and no scratches appear on the surface of the sapphire.

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Lapping performance of mixed-size agglomerated diamond abrasives in fixed abrasives pads

Cited by 22 publications

References 22 publications

Influence of Binding Agent on the Cutting Performance and Wear Characteristics of Catalytic Composite Abrasive Cluster

Influence of Binding Agent on the Cutting Performance and Wear Characteristics of Catalytic Composite Abrasive Cluster

Research on the Preparation and Application of Fixed-Abrasive Tools Based on Solid-Phase Reactions for Sapphire Wafer Lapping and Polishing

The Preparation and Performance Analysis of a Cr2O3 Gel Abrasive Tool for Sapphire Substrate Polishing

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