Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions

Hou, Juncai; Zhang, Qiu-Mei; He, Siliang; Bian, Jingru; Jiu, Jinting; Li, Chang-Jiu; Nishikawa, Hiroshi

doi:10.1007/s10854-021-06556-4

Cited by 2 publications

(2 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, such a method generally requires bonding temperatures above 300 °C and bonding times greater than 30 min [ 11 , 12 , 13 ]. As the world moves towards reducing energy consumption and achieving carbon neutrality, there is a significant need for developing reliable joints of electronic packaging that can be fabricated at low temperatures and withstand high temperatures [ 14 , 15 ]. Recent advancements in low-temperature transient liquid phase bonding (TLPB) have resulted in the development of die package joints capable of withstanding higher service temperatures at lower bonding temperatures [ 16 , 17 ].…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Xiong

et al. 2023

Materials

Self Cite

View full text Add to dashboard Cite

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu6Sn5 forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu3Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.

show abstract

Section: Introductionmentioning

confidence: 99%

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Xiong

et al. 2023

Materials

Self Cite

View full text Add to dashboard Cite

show abstract

“…[13][14][15][16] Compared with other coating preparation processes, cold spraying has the advantage of not causing coating oxidation and crystallization, so cold spraying technology is especially suitable for the preparation of oxidation-sensitive material coatings, such as Cu. [17,18] Yin et al [19] successfully prepared a Cu coating on Cu substrate by cold spraying and analyzed the effect of Cu particle preheating temperature on the deposition behavior of coatings in detail. It is found that with increasing particle initial temperature, particle will deform more intensively, which will make the preheated particles more likely to deposit on the substrate surface.…”

Section: Introductionmentioning

confidence: 99%

Improvement of Microstructure and Properties of Cu Coatings Prepared with Cold Spraying by Plasma Heating

Wang

Chang

et al. 2022

Adv Eng Mater

View full text Add to dashboard Cite

To improve the microstructure and properties of Cu coating prepared by cold spraying, the plasma heating is used during the cold spraying process. The models of Cu particles deposited on a Cu substrate during cold spraying process without/with plasma heating are established and calculated, and the results are compared. The calculated results show that the plasma heating causes copper particles and substrates to produce greater plastic deformation during deposition. The microstructure of Cu coating prepared by cold spraying with plasma heating is experimentally investigated. Plasma heating can effectively reduce the porosity of the copper coating, improve the binding between the coating and the substrate, and reduce the grain size of the coating, which is due to the greater deformation of the copper particles under plasma heating. The experimental results are consistent with the calculation results. The results of the coating immersion experiments show that the corrosion rate of the Cu coating prepared by plasma‐assisted low‐pressure cold spraying is reduced from 1.5 to 0.094 mg cm−2 h compared with the samples prepared without plasma heating under the same conditions, which is due to the reduced porosity of the coating.

show abstract

Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions

Cited by 2 publications

References 34 publications

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Improvement of Microstructure and Properties of Cu Coatings Prepared with Cold Spraying by Plasma Heating

Contact Info

Product

Resources

About