International Conference on Extreme Ultraviolet Lithography 2019 2019
DOI: 10.1117/12.2536943
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Large area EUV via yield analysis for single damascene process: voltage contrast, CD and defect metrology (Conference Presentation)

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“…Note: All the results reported in this section are part of an imec-ASML- HMI collaboration, see 10 for additional details. The e-beam tool used for this work is HMI eP5.…”
Section: Resultsmentioning
confidence: 99%
“…Note: All the results reported in this section are part of an imec-ASML- HMI collaboration, see 10 for additional details. The e-beam tool used for this work is HMI eP5.…”
Section: Resultsmentioning
confidence: 99%