Large area pressureless Cu-Cu bonding using formic acid-treated Cu particles for power device packaging

Xu, Yue; Dai, Dongfang; Yang, Renbin; Qian, Jing; Wang, Ping; Chen, Xianping

doi:10.1109/icept56209.2022.9873355

Cited by 1 publication

(1 citation statement)

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“…Adding copper formate can further fill the gaps and form a more solid structure with improved electrical conductance [ 17 ]. A recent report verified that copper formate additives in copper nanoparticle pastes decomposed into new active nano copper at 300 °C and were able to strengthen the Cu-Cu joints bonded in the process [ 18 ]. The goal of this study is to robustly bond the samples at a temperature of 160 °C, which vulnerable polymeric substrates can withstand.…”

Section: Introductionmentioning

confidence: 99%

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Liao

et al. 2022

Nanomaterials

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Cu-Ag composite pastes consisting of carboxylate-capped Ag nanoparticles, spray-pyrolyzed Ag submicron particles, and copper formate were developed in this study for low-temperature low-pressure bonding. The joints between the Cu, Ni/Au, and Ag finished substrates can be well formed at temperatures as low as 160 °C under a load pressure of 1.6 MPa. The joints with Cu substrates possess 18.0 MPa bonding strength, while those with Ag surface finish could be enhanced to 23.3 MPa. When subject to sintering under 10 MPa at 160 °C, the electrical resistivity of the sintered structure on metal-coated polymeric substrates was around 11~17 μΩ-cm and did not differ too much when subjected to harsh reliability tests such as mechanical bending and thermal cycling tests, as well as electrical current stressing. This low-temperature, low-pressure nanocomposite paste shows great potential as interconnect materials for microelectronics or flexible device assembly.

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Section: Introductionmentioning

confidence: 99%

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Liao

et al. 2022

Nanomaterials

View full text Add to dashboard Cite

show abstract

Large area pressureless Cu-Cu bonding using formic acid-treated Cu particles for power device packaging

Cited by 1 publication

References 9 publications

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

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