2005
DOI: 10.1002/adma.200500578
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Large‐Area, Selective Transfer of Microstructured Silicon: A Printing‐ Based Approach to High‐Performance Thin‐Film Transistors Supported on Flexible Substrates

Abstract: the protein adsorption assay, and onto a glass substrate for the cell and platelet adhesion assay. The samples were subsequently heated to 100 C under vacuum for 1 h. It was confirmed by XPS (O/C atomic ratio) that the surface structure of the present sample (heated at 100 C for 1 h) was almost the same as that of the equilibrated sample [8], which was heated at 140 C for 12±24 h.Surface Analysis: The surfaces of the samples were observed using an SEM (XL30, FEI Japan Ltd., Japan), a profile measurement micros… Show more

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Cited by 132 publications
(115 citation statements)
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“…The BaTiO 3 thin film was then transferred onto a flexible substrate by means of standard microfabrication and soft lithographic printing techniques. [17][18][19][20] To measure the positive and negative output voltage/current signals, we deposited the IDEs on flexible BaTiO 3 . Figure 1a shows a schematic of the fabrication steps.…”
mentioning
confidence: 99%
“…The BaTiO 3 thin film was then transferred onto a flexible substrate by means of standard microfabrication and soft lithographic printing techniques. [17][18][19][20] To measure the positive and negative output voltage/current signals, we deposited the IDEs on flexible BaTiO 3 . Figure 1a shows a schematic of the fabrication steps.…”
mentioning
confidence: 99%
“…Poor charge carrier mobility in these devices [in comparison, the electron mobility in single-crystal silicon transistors exceeds 1,000 cm 2 ͞V-s (14)] translates to poor frequency response and high power consumption. Some of the best devices demonstrated to date were made by means of a creative approach that uses silicon ribbons released from a wafer and reassembled on a polymer substrate to yield stretchable circuits (15,16). This method has produced circuits with form factors replicating the original silicon wafer (the area and coverage attained are similar to a wafer originally used for processing) and with performance parameters that are affected by strain applied to the substrate.…”
mentioning
confidence: 99%
“…The mechanically soft nature of the stamp avoids fracture in the NMs during this process. 45,69,[71][72][73][74] An important consideration is in control over the adhesion between nanomaterials and the surfaces of the stamps, in ways that allow switching from strong to weak states for retrieval and printing, respectively. 69,70,75,76 Various approaches, ranging from those that exploit viscoelastic effects 69,75 to interface shear loading 76 to pressureinduced contact modulation, 70,77 can be effective.…”
Section: Assemblymentioning
confidence: 99%