2022
DOI: 10.3390/mi13060907
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Large Curvature Self-Folding Method of a Thick Metal Layer for Hinged Origami/Kirigami Stretchable Electronic Devices

Abstract: A self-folding method that can fold a thick (~10 μm) metal layer with a large curvature (>1 mm−1) and is resistant to repetitive folding deformation is proposed. Given the successful usage of hinged origami/kirigami structures forms in deployable structures, they show strong potential for application in stretchable electronic devices. There are, however, two key difficulties in applying origami/kirigami methods to stretchable electronic devices. The first is that a thick metal layer used as the conductive l… Show more

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Cited by 14 publications
(12 citation statements)
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“…(a) Folding times to form creases of pure PI films under various folding radii, (b) dichroic ratio change of pure PI films during dynamic folding under a curvature radius of 0.25 mm, (c) dichroic ratio of various PI films after folding 10,000 times under a curvature radius of 0.25 mm, and (d) comparison of the folding resistance of PICu films with other similar research. ,, ,, …”
Section: Resultsmentioning
confidence: 90%
“…(a) Folding times to form creases of pure PI films under various folding radii, (b) dichroic ratio change of pure PI films during dynamic folding under a curvature radius of 0.25 mm, (c) dichroic ratio of various PI films after folding 10,000 times under a curvature radius of 0.25 mm, and (d) comparison of the folding resistance of PICu films with other similar research. ,, ,, …”
Section: Resultsmentioning
confidence: 90%
“…Securing mechanical and electrical stability under repeated folding and rolling through frictionless interface design is a major challenge in manufacturing dynamic displays. The paper-like displays must endure harsh mechanical stress that cannot be resolved by a single neutral plane, hence stress-regulated substrates and multilayer interface modulation should be developed 23 . The 3D free-form displays are based on intrinsically deformable materials and novel integration strategies to relieve the applied stress 24 .…”
Section: Introductionmentioning
confidence: 99%
“…In this study, we fabricated an origami structure of a substrate by self-folding and realized an origami-type flexible TEG that yields the mounting of rigid TE elements with high thermal-conversion efficiency. Self-folding is a technique of spontaneously folding structures using the deformation of active materials, such as heat-shrinkable films, in response to external stimuli, such as heat, and it effectively fabricates origami structures that are difficult to fold manually [ 19 , 20 , 21 ]. Generally, it is difficult to form a bellows fold using the conventional self-folding method for devices such as TEGs, which have TE elements sandwiched between the top and bottom substrates, because the active material cannot be pre-assembled into the substrate because of the negative effects on the active material caused by thermal stimulation from the mounting of the element.…”
Section: Introductionmentioning
confidence: 99%