Large-field particle beam optics for projection and proximity printing and for maskless lithography

Loeschner, Hans; Stengl, G.; Buschbeck, H.; Chalupka, A.; Lammer, G.; Platzgummer, Elmar; Vonach, H.; Jager, de P.W.H.; Kaesmaier, Rainer; Ehrmann, Albrecht; Hirscher, Stefan; Wolter, Andreas; Dietzel, Andreas; Berger, Rüdiger; Grimm, H.; Terris, B. D.; Bruenger, W. H.; Gross, G.; Fortagne, Olaf; Adam, Dieter; Boehm, Michael W.; Eichhorn, Hans; Springer, Reinhard; Butschke, Joerg; Letzkus, Florian; Ruchhoeft, Paul; Wolfe, J. C.

doi:10.1117/1.1528946

Cited by 12 publications

(7 citation statements)

References 16 publications

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“…Implementing muitipole lens electrodes in the column, electrostatic step exposure (ESE) techniques (Loeschner etal., 2003) will add to the versatility for "rapid nanotyping". This enables the realization of any pattern (including "doughnut structures" and oblique patterns) with one single stencil mask, thus eliminating the need of complementary stencil mask overlay.…”

Section: Ionmentioning

confidence: 99%

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New tools for nanotechnology

Fantner

Loeschner

2003

Elektrotech. Inftech.

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The article provides an overview of recent developments in nano-lithography for high-volume chip production. The need for Mask-Less Lithography (ML2) is outlined in particular for rapid prototyping of chips and for the fabrication of ASICs (Application Integrated Circuits), SoC (System on Chips), logic circuits and other low and medium volume production integrated circuits (ICs). A short overview of current ML2 development efforts in Europe, Japan and the US is given. The IMS Nanofabrication concept of Projection Mask-Less Lithography (PML2) and the corresponding MEDEA+ 7"409 EUREKA project are explained. Then a short introduction to Micro@Nano-technologies is provided, pointing out that ion beam techniques offer unique opportunities for combining "'top-down" direct-structuring and modification of materials and surfaces with "bottom-up" self-assembly techniques as needed for a variety of promising Micro@Nano technology application fields. The IMS Nanofabrication PROFIB (Projection Focused Ion multi-Beam tool) concept is outlined. This concept is an integral part of the Micro@Nano-FabricationAustria (MNFA) initiative, which will be presented at the end of this paper. Both novel tools for nanotechnology, PML2 and PROFIB, are based on 200× reduction large-field particle optics at the core of the IMS Micro@Nano Platform Technology. Keywords: mask-less lithography; ion beam micro-and nano-technology Neue Tools f~Jr die Nanotechnologie. Am Beginn dieses Artikels werden die Entwicklungen im Bereich der Nanolithograpie fLir die Produktion von integrierten Schaltkreisen mit grol3en Sti3ckzahlen dargestellt. FLir die Chip-Prototypenentwicklung und f~ir die Produktion von kundenspezifischen SoC(System on

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Section: Ionmentioning

confidence: 99%

“…The electron based Projection Mask-Less Lithography (PML2) concept has been developed by IMS Nanofabrication based on substantial expertise in large-field particle optics (Loeschner etaL, 2003) as obtained through many years of development. In the PML2 electron-optical column (Fig.…”

Section: M S N a N O F A B R I C A T I O N P R O J E C T I O N M A mentioning

confidence: 99%

New tools for nanotechnology

Fantner

Loeschner

2003

Elektrotech. Inftech.

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“…For example, although Zone-Plate-Array Lithography (ZPAL) uses an array of optical sources to expose resist-coated wafers, the resolution of the zone-plate lenses is not nearly as high as with the antenna transducers. 28,29 Other maskless systems, like ion projection systems and field emission carbon nano-tube arrays, 30,31 can potentially achieve high resolution and throughput, but the wafers must be exposed in a vacuum environment. Commercial lithographic tool maker ASML and Swiss company Micronic Laser Systems, Inc., are combining deep ultraviolet (193 nm) lithography tools with micro-mirror arrays for a maskless lithography system with 180 nm resolution.…”

Section: Introductionmentioning

confidence: 99%

Maskless lithography with the solid immersion lens nanoprobes

et al. 2004

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The International Technology Roadmap for Semiconductors (ITRS) shows that 45 nm and lower feature sizes are required in lithographic production before the year 2007. Both immersion lithography and EUV lithography can play major roles in realizing this goal. However, a maskless lithography system capable of producing 45 nm features is an attractive option for small-volume semiconductor fabrication, such as with ASIC manufactures. Compared with a conventional lithography system, the maskless feature of the system allows the chip designer to be free of the very expensive process of mask fabrication and to shortcut development time. In this paper, we discuss a new maskless lithography concept employing an array of solid immersion lens (SIL) nano-probes. The nano-probes are efficient nearfield transducers. Each transducer is the combination a SIL, a dielectric probe tip and an antenna structure. The nanoprobes are fabricated in arrays that dramatically improve throughput. By combining these technologies, it should be possible to fabricate an efficient array of near-field transducers with optical spot dimensions of around 20 nm when illuminated by a 405 nm laser diode source. This paper plans to address, for the first time, the efficient generation of an array of light spots with dimensions of /20 or less that couple efficiently into dielectric films, like photoresist.

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“…The PML2 concept [3,4], using a multitude of dynamically controlled parallel beams, enables an essential throughput increase and high flexibility which leads to further cost of ownership improvement for advanced low volume device production. Due to its system principles of using a single source and a single optical column the overall complexity can be kept low which yields high system reliability and uptime.…”

Section: Introductionmentioning

confidence: 99%

Proof-of-concept tool development for projection mask-less lithography (PML2)

et al. 2005

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Electron beam based Projection Mask-Less Lithography (PML2) is one of the promising candidates for small and medium volume device production for the 45nm technology node and beyond. The concept of the PML2 proof-ofconcept tool, to be realized as part of the European MEDEA+ project T409, comprises a single electron optical column, a multi beam blanking device (programmable "Aperture Plate System") including high speed optical data path and a scanning 300mm wafer stage. More than 250.000 beams will be projected onto the wafer used for a highly redundant scanning stripe exposure process. A demonstrator chip of the Aperture Plate System is being manufactured with > 1000 apertures of 5µm x 5µm size using standard MST processes. Results as achieved with this demonstrator chip using a specifically designed e-beam test bench are shown. Furthermore, the realtime data transmission concept is discussed, showing that with the selected technology the required data rates for the PML2 proof-of-concept tool can be delivered, with extendibility beyond. Viability of the optical data pattern transfer to the Aperture Plate System is shown using a test setup of the parallel high-speed transmission lines.

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Large-field particle beam optics for projection and proximity printing and for maskless lithography

Cited by 12 publications

References 16 publications

New tools for nanotechnology

New tools for nanotechnology

Maskless lithography with the solid immersion lens nanoprobes

Proof-of-concept tool development for projection mask-less lithography (PML2)

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