Large Scale Engineered Nanostructured Surfaces by Reactive Ion Etching with Kinetically Self-Assembled Non-continuous Metal Film as Etching Mask

Wei, Wei; Bachman, Mark; Li, G.P.

doi:10.1557/proc-849-kk8.6

Cited by 3 publications

(4 citation statements)

References 22 publications

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“…To the authors' knowledge, this is the first effort to fabricate surperhydrophobic surfaces using DNM and DRIE. This fabrication technique has some similarity with that reported by Wei et al, who used silver (Ag) nanoislands and reactive ion etching (RIE) to produce hydrophobic surfaces [10].…”

Section: Introductionsupporting

confidence: 58%

“…For example, they can be used in microfluidic systems to effectively control the flow of fluids through the change of surface friction between the fluids and the walls of microchannels. Because of the wide range of applications of superhydrophobic surfaces, various methods of creating superhydrophobic surfaces have been studied [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]. These methods include lithography [1], template [2], chemical modification on alloy [14,17,19], nanofibres and aligned carbon nanotubes [20][21][22], electrochemical deposition [9,23], aligned nanorods [18,24], dissolving polypropylene in solvents at low temperatures [25], and many others.…”

Section: Introductionmentioning

confidence: 99%

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Superhydrophobic surfaces by dynamic nanomasking and deep reactive ion etching

Song¹,

Zou²

2007

Proceedings of the Institution of Mechanical Engineers, Part N:

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This paper reports a study on fabricating superhydrophobic surfaces with microand nanohierarchical topography by dynamic nanomasking (DNM) and deep reactive ion etching (DRIE). In this study, thin layers of gold (Au) were sputtered on silicon (Si) wafers followed by annealing the samples in a conventional furnace to break the thin films into Au nanoparticles attached to the Si surfaces. These randomly distributed nanoparticles served as dynamic nanomasks during DRIE processes, in which sulphur hexafluoride (SF 6 ) and octofluorocyclobutane (C 4 F 8 ) were used as etching and polymerization gases, respectively. Surface topography and wetting properties of the samples were characterized by scanning electron microscopy (SEM) and a video-based optical contact angle meter (VOCAM). SEM images show that this technique created micro-sized craters with Au nanoparticles residing on the ridges of the microstructures. The largest water contact angle (WCA) obtained by this method is about 163 . The surface superhydrophobicity is attributed to the combination of micro-and nanohierarchical topography and surface polymerization.

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Section: Introductionsupporting

confidence: 58%

Section: Introductionmentioning

confidence: 99%

Superhydrophobic surfaces by dynamic nanomasking and deep reactive ion etching

Song¹,

Zou²

2007

Proceedings of the Institution of Mechanical Engineers, Part N:

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“…RIE with CHF 3 has been used to remove SiO 2 on the sides and tops of the core/shell nanowires of Si and SiO 2 and develop a scalable method for patterning nanometer scale lines hierarchically over large areas [40]. Wei et al [41] engineered nanostructured surfaces by using non-continuous metal films as RIE etching mask. Densely packed, wellordered, high aspect-ratio Si nanopillars patterned over large substrate areas using block copolymer lithography and RIE have been fabricated by Gowrishankar et al [42].…”

Section: Introductionmentioning

confidence: 99%

Free standing luminescent silicon quantum dots: evidence of quantum confinement and defect related transitions

et al. 2010

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We report the synthesis of luminescent, free standing silicon quantum dots by dry and wet etching of silicon and silicon oxide core/shell nanostructures, which are synthesized by controlled oxidation of mechanically milled silicon. Dry and wet etching performed with CF(4) plasma and aqueous HF, respectively, result in the removal of the thick oxide shell of the core/shell nanostructures and affect an additional step of size reduction. HF etch is capable of producing isolated, spherical quantum dots of silicon with dimensions ∼ 2 nm. However, the etching processes introduce unsaturated bonds at the surface of the nanocrystals which are subsequently passivated by oxygen on exposure to ambient atmosphere. The photoluminescence spectra of the colloidal suspensions of these nanocrystals are characterized by double peaks and excitation dependent shift of emission energy. Comparison of the structural, absorption and luminescence characteristics of the samples provides evidence for two competing transition processes--quantum confinement induced widened band gap related transitions and oxide associated interface state mediated transitions. The results enable us to experimentally distinguish between the contributions of the two different transition mechanisms, which has hitherto been a challenging problem.

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“…Wei et al used E-beam deposition of non-continuous Ag film on silicon dioxide, followed by vacuum annealing [39]. This annealing caused Ag molecules to migrate and agglomerate, resulting in nano-scale Ag islands.…”

Section: Subtractive Techniquesmentioning

confidence: 99%

Effects of Contacting Surfaces on MEMS Device Reliability

Du¹,

Groot²,

Kogut

et al. 2010

Journal of Adhesion Science and Technology

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A multi-asperity contact model with adhesion is presented to analyze the real contact of microdevices, including contact force, contact area, and pull-off force. Since the macroscopic contact of two contacting surfaces is the statistical average of many individual micro/nano contacts, the key point is to include an accurate analysis of the discrete contacts. A finite element model which is applicable to a wide range of material properties was developed to study adhesion and plasticity of a single contact during both loading and unloading cycles in a previous investigation. The best fits of the results by comparing with the existing models are introduced in this work for both the loading and unloading (pull-off force) analyses. Pearson Type distributions which can independently adjust the skewness and kurtosis of surface heights are used to study the multi-asperity contact. The significance of this work is not only to predict adhesion of the existing devices, but to provide an optimal design of surface characteristics and material properties to improve device reliability.An overview of the status of surface roughening indicates that various techniques exist to tailor surface morphological properties, but that these techniques mainly target the mean and root-mean-square (rms) values of the roughness. This approach insufficiently utilizes all available techniques to minimize adhesion force between surfaces. New approaches that include surface roughness process development should include a range of skewness and kurtosis values of the resulting surface as a design consideration in addition to the mean and rms values of the roughness.

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Large Scale Engineered Nanostructured Surfaces by Reactive Ion Etching with Kinetically Self-Assembled Non-continuous Metal Film as Etching Mask

Cited by 3 publications

References 22 publications

Superhydrophobic surfaces by dynamic nanomasking and deep reactive ion etching

Superhydrophobic surfaces by dynamic nanomasking and deep reactive ion etching

Free standing luminescent silicon quantum dots: evidence of quantum confinement and defect related transitions

Effects of Contacting Surfaces on MEMS Device Reliability

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