Large-scale full-wave simulation

Kapur, Sharad

doi:10.1145/996566.996782

Cited by 29 publications

(15 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…O(N log N) for dense linear systems. These algorithms include Fast Multipole Method (FMM) [1]- [3], precorrected-Fast Fourier Transform [4], [5], and SVD compression [6]. Despite of the large variety of acceleration algorithms and efficient codes, there is no single code that is capable of solving 3-D full-wave Maxwell's equations for arbitrary and very large structures over substrate.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

pFFT in FastMaxwell: A Fast Impedance Extraction Solver for 3D Conductor Structures over Substrate

Moselhy¹,

Hu²,

Daniel³

2007

2007 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition

View full text Add to dashboard Cite

Abstract- I. INTRODUCTIONThe integration of RF, analog and digital circuitry on a single integrated-circuit substrate, or system-on-chip (SoC), is associated with many challenges. For instance, substrate noise may lead to altered circuit performance. In addition, conductor skin and proximity effects may impact current return paths in a network of closely-spaced conductors, as well as quality factor in RF inductors. Moreover, the occurrence of radiated electromagnetic interferences (EMI) may transmit disturbances across different SoC systems. In order to avoid all the above problems, electromagnetic simulation tools are needed that can accurately and efficiently extract wide-band full-wave conductor impedances in the presence of semi-conducting substrates.In the last decade, electromagnetic simulators based on integral formulations have been the subject of extensive research due to the development of fast algorithms i.e. O (N log N) In this paper we present a 3D full-wave simulator based on the mixed potential integral equation formulation (MPIE) [7], [8], and accelerated using p-FFT. The solver will be released on public domain starting from December 2006 [9].

show abstract

Section: Introductionmentioning

confidence: 99%

“…FASTIMP [5] solves only the full-wave free space propagation problem and is therefore not suitable for simulating substrate effects. EMX [3] is based on 2.5D formulations with planar metal structures assumed of infinitesimal thickness. This is similar to the formulation in IE3D, though the latter has the ability to model 3-D structures.…”

Section: Introductionmentioning

confidence: 99%

pFFT in FastMaxwell: A Fast Impedance Extraction Solver for 3D Conductor Structures over Substrate

Moselhy¹,

Hu²,

Daniel³

2007

2007 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition

View full text Add to dashboard Cite

show abstract

“…By imposing the orthogonality condition (26) we obtain the following recursive formulation for and , shown in (27) at the bottom of the page, where and denote the th derivative of and at the expansion point . Since the bandwidth of Taylor expansion is limited, we convert Taylor series into a Padé rational function, which has a larger radius of convergence.…”

Section: E Fast Frequency Sweep Techniquementioning

confidence: 99%

“…The multilayered dielectric has not yet been accounted for. Integral equation based methods have also been developed in [22]- [26] for the application to on-chip problems. It is expected that an integral equation based solution that takes all the on-chip intricacies into consideration, and accelerated by the fast algorithms will soon be completed.…”

mentioning

confidence: 99%

A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Jiao

Zhu

Chakravarty

2008

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

S., "A fast frequency-domain eigenvalue-based approach to full-wave modeling of large-scale three-dimensional on-chip interconnect structures" (2008) Abstract-As on-chip circuits have scaled into the deep submicron regime, electromagnetics-based analysis has increasingly become essential for high-performance integrated circuit (IC) design. Not only fast, but also high-capacity electromagnetic solutions are demanded to overcome the large problem size facing on-chip design community. In this paper, we present a novel, high-capacity, and fast approach to the full-wave modeling of 3-D on-chip interconnect structures. In this approach, the interconnect structure is decomposed into a number of seeds. In each seed, the original wave propagation problem is represented as a generalized eigenvalue problem. The resulting eigenvalue representation can comprehend both conductor and dielectric losses, arbitrary dielectric and conductor configuration in the transverse cross section, and arbitrary material. A new mode-matching technique applicable to on-chip interconnects is developed to solve large-scale 3-D problems by using 2-D-like CPU time and memory. A junction matrix acceleration technique is proposed to speed up the mode matching process. A fast frequency sweep technique is employed to obtain the response over the entire frequency band by solving at one or a few frequency points only. An extraction technique is developed to obtain S-parameters from the solution of the eigenvalue system. The entire procedure is numerically rigorous without making any theoretical approximation. Experimental and numerical results demonstrate its accuracy and efficiency.

show abstract

“…The design procedure for the baluns was to first use electromagnetic simulation to determine the characteristics of the coupled inductors. 4 These were placed in a circuit simulator, and optimization was used to tune the values of the capacitors. Final verification of the circuit was done with EM simulation of the full layout.…”

Section: Circuit Descriptionmentioning

confidence: 99%