2000
DOI: 10.1007/s11664-000-0196-z
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Large VLWIR Hg1−xCdxTe photovoltaic detectors

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Cited by 8 publications
(3 citation statements)
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“…8,9 In the absence of any nonideal diode currents (e.g., surface recombination, bulk generation recombination, and trap-assisted tunneling currents) and lateral carrier-diffusion effects, a simple one-dimensional analysis of diode diffusion currents can be employed to determine the relation of R 0 A to HgCdTe material parameters, such as minority carrier (hole) lifetime ( p ), hole diffusion length (L p ), back-interface recombination velocity (S), and absorbing layer thickness (d): 8,10,11 (1) where N d is the donor doping density on the n side of the P ϩ /n junction, n i is the intrinsic carrier concentration, k is the Boltzmann's constant, and T is the temperature. 8,9 In the absence of any nonideal diode currents (e.g., surface recombination, bulk generation recombination, and trap-assisted tunneling currents) and lateral carrier-diffusion effects, a simple one-dimensional analysis of diode diffusion currents can be employed to determine the relation of R 0 A to HgCdTe material parameters, such as minority carrier (hole) lifetime ( p ), hole diffusion length (L p ), back-interface recombination velocity (S), and absorbing layer thickness (d): 8,10,11 (1) where N d is the donor doping density on the n side of the P ϩ /n junction, n i is the intrinsic carrier concentration, k is the Boltzmann's constant, and T is the temperature.…”
Section: Device Architecturementioning
confidence: 99%
“…8,9 In the absence of any nonideal diode currents (e.g., surface recombination, bulk generation recombination, and trap-assisted tunneling currents) and lateral carrier-diffusion effects, a simple one-dimensional analysis of diode diffusion currents can be employed to determine the relation of R 0 A to HgCdTe material parameters, such as minority carrier (hole) lifetime ( p ), hole diffusion length (L p ), back-interface recombination velocity (S), and absorbing layer thickness (d): 8,10,11 (1) where N d is the donor doping density on the n side of the P ϩ /n junction, n i is the intrinsic carrier concentration, k is the Boltzmann's constant, and T is the temperature. 8,9 In the absence of any nonideal diode currents (e.g., surface recombination, bulk generation recombination, and trap-assisted tunneling currents) and lateral carrier-diffusion effects, a simple one-dimensional analysis of diode diffusion currents can be employed to determine the relation of R 0 A to HgCdTe material parameters, such as minority carrier (hole) lifetime ( p ), hole diffusion length (L p ), back-interface recombination velocity (S), and absorbing layer thickness (d): 8,10,11 (1) where N d is the donor doping density on the n side of the P ϩ /n junction, n i is the intrinsic carrier concentration, k is the Boltzmann's constant, and T is the temperature.…”
Section: Device Architecturementioning
confidence: 99%
“…However, one of the big problems associated with the planar-type detector arrays is the extension of the photo-sensitive area due to the lateral collection effect of photogenerated holes in the absorbing layer [5]. Recently, instead of suppressing the extension of the photo-sensitive area, this lateral collection effect in the planar-type detector arrays is utilized in the fabrication of VLWIR HgCdTe FPA detector chips and visible CCD detectors [6]. To investigate the photoresponse characteristics of the lateral collection effect and then further apply it to fabricate InGaAs detectors is meaningful.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Another technique for increasing the operability of VLWIR FPAs is by each pixel being divided into subelements. 4 A pixel divided into four subelements results in the probability of any single subelement having a defect being lowered by a factor of four relative to the probability that a single large pixel has a defect.…”
mentioning
confidence: 99%