Laser 3D micro-manufacturing

Piqué, Alberto; Auyeung, R. C. Y.; Kim, Heung Soo; Charipar, Nicholas A.; Mathews, Scott A.

doi:10.1088/0022-3727/49/22/223001

Cited by 103 publications

(81 citation statements)

References 209 publications

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“…The typical setup for an LCP experiment is shown in Figure a. In analogy to LIFT, a pulsed laser source is directed to a polymer film, named donor, supported on a carrier substrate transparent to the laser radiation. A second substrate, facing the donor and in close proximity to it, receives and collects the ejected material from the polymer film.…”

Section: Resultsmentioning

confidence: 99%

Single‐Shot Laser Additive Manufacturing of High Fill‐Factor Microlens Arrays

Surdo

Carzino

Diaspro

et al. 2018

Advanced Optical Materials

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Various methods have been adopted for the high-FF fabrication of MLA. Hexagonal arrays with 100% FF have been demonstrated by self-assembly methods based on dewetting, [7] localized water condensation, [8] or surface wrinkling, [9] but these approaches typically lack control in the design and positioning of the microlenses. In contrast, photolithography techniques have become the gold standard for the production of customized high-FF MLA. [10][11][12][13] Even if unrivaled industrial upscaling is possible, photolithography is optimized for planar substrates and requires multistep processing in expensive clean room facilities. More importantly, the need of masks imposes an additional limit in the degree of tunability of the MLA designs in timely fashion.Alternatively, direct-write technologies (DWTs) such as inkjet printing, [14] microdispensing, [15] two-photon polymerization, [16] laser-induced forward transfer (LIFT), [17,18] or multibeam interferencebased holography [19] enable the direct and maskless fabrication of polymeric microlenses and MLA with perfectly optical quality on a variety of substrates. In this case, though, the use of liquid prepolymers can result in merging of adjacent microlenses that seriously constraints the attainable FF of the arrays. [20] Recent works to improve the FF using DWTs include the fabrication of concave MLA using laser ablation followed by a replica molding step. [21,22] Despite excellent results in terms of uniformity and FF, this approach impedes the direct fabrication of MLA on substrates of interest. Furthermore, most DWTs require complex systems or ultrafast lasers for parallelization, which limit the overall throughput of these systems. Simply put, a low-cost and maskless technique capable of directly generating high-FF arrays at high-throughputs, with controlled geometry and at targeted positions on nonplanar substrates does not exist.In this work, we present a novel laser-based method for the realization of high-FF polymeric microlens arrays that addresses the limitations of traditional direct-write and photolithographic approaches. Our method, termed laser catapulting or LCP, exploits short (in the nanosecond scale) high-energy laser pulses to transfer polymeric solid microdiscs from a uniform film into targeted positions on a receiver substrate. After thermal reflow, namely the heating of the microdiscs above their glass transition temperature (T g ), planoconvex microlenses are obtained. Notably, the direct printing of discs in the solid-state enables the generation of highly close-packed High fill-factor microlens arrays (MLA) are key for improving photon collection efficiency in light-sensitive devices. Although several techniques are now capable of producing high-quality MLA, they can be limited in fill-factor, precision, the range of suitable substrates, or the possibility to generate arbitrary arrays. Here, a novel additive direct-write method for rapid and customized fabrication of high fill-factor MLA over a variety of substrates is demonstrated. This appro...

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Section: Resultsmentioning

confidence: 99%

Single‐Shot Laser Additive Manufacturing of High Fill‐Factor Microlens Arrays

Surdo

Carzino

Diaspro

et al. 2018

Advanced Optical Materials

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“…Therefore, even performing non‐resonant direct laser writing, the mechanism behind the LIFT of PPV is based on a thermal process, involving absorption and melting of the donor followed by its solidification on the receptor substrate. Because the interaction occurs on an ultrafast time scale, limited heat diffusion prior to ejection enables high precision deposition without damaging the material's properties and structure …”

Section: Resultsmentioning

confidence: 99%

“…This paper describes the printing of luminescent microcircuits based on the LIFT of PPV. In particular, LIFT has been applied using femtosecond laser pulses (fs‐LIFT), which is advantageous because of the ability to improve the resolution of the deposited structures due to multiphoton absorption . Consequently, as demonstrated by optical and spectroscopy analyses, the structure and properties of PPV are preserved in the transferred substrate, allowing its applicability for printing/patterning of active layers in electro‐optical devices.…”

Section: Introductionmentioning

confidence: 99%

Micropatterning of poly(p‐phenylene vinylene) by femtosecond laser induced forward transfer

Almeida

Avila

Andrade

et al. 2018

Polymer International

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Conjugated polymers are important materials for optical applications, among which poly(p‐phenylene vinylene) (PPV) has a major role due to its applicability in sensors, organic light‐emitting diodes and large area displays. Despite advances on the synthesis of PPV‐based polymers and the improvements of their properties, its printing process, in particular involving the solid phase, remains unsuitable for the development of electro‐optical microcircuits. This paper demonstrates the printing of PPV from the solid phase in 2D micropatterns. Such an achievement was performed using laser induced forward transfer with femtosecond pulses, which allows area‐selective deposition within reduced scales as thin as ca 100 nm and 5 µm wide. Raman, fluorescence and electrochemical impedance spectroscopies confirm that the printed PPV micropatterns have the same structure, emission spectrum and conductivity as the target material, revealing the conservation of their original properties even after laser irradiation. The printing process was carried out using PPV films, overcoming the insolubility issue of this material. The optical and electrical characterization of the transferred PPV demonstrates the potential of this method for the patterning of electro‐optical microdevices, since luminescence and electrical conductivity were preserved. © 2018 Society of Chemical Industry

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“…The triazene polymer has higher absorption coefficient, lower ablation threshold and cleaner ablated surface with no debris, which is more desirable for the choice of the intermediate layer. The advantage of the above improvements is the materials with weak absorption of the laser pulse or materials that can be damaged under laser radiation can be accommodated to the LIFT process . Therefore, LIFT is possible to be compatible with sensitive functional materials (mostly organics) for high‐performance printed electronics (one of the mainstream direction of flexible electronics).…”

Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

112

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materials and enable innovative applications that are hard to achieve with current microelectronics. Examples vary from biointegrated devices for clinical diagnosis and treatment, [11][12][13] to electronic skin (E-Skin), [14][15][16] energy harvesting/storage devices, [17][18][19][20][21] and sweat sensor, [22,23] to flexible display, [24,25] and to RFID tags, [26,27] etc.Two main kinds of microfabrication processes have been developed for flexible electronics, including the solutionprocessable methods and vacuum-based methods (lithographic patterning and undercut etching). [28] The former is naturally compatible with flexible substrates and can deposit and pattern functional materials in one single step. [29][30][31] They have fabricated various printed electronics with increasing performance, such as conductive metal wires, [32][33][34] thin film transistors (TFTs), [35][36][37] and piezoelectric devices. [38][39][40][41] However, the electronic performance is still limited by the properties of solution-processable functional materials and low resolution of printing techniques, with respect to standard microfabrication process. [42] On the other side, vacuum-based microfabrication techniques provide wellestablished routes to realize high-performance electronics, but generally incompatible with large-area, flexible (polymeric substrates). Ideally, high performance flexible electronics systems are usually fabricated by built-up process that begins with independent fabrication of high-modulus, fragile, chip-scale elements (e.g., IC chips, MEMS, sensors, and power sources) or flexible devices (e.g., flexible sensor, flexible display, and TFT array) on donor wafers, followed by being transferred onto flexible/stretchable substrates.The above manufacturing routes of flexible electronics can be concluded as the transfer of the materials, components, and devices from original fabricated/prepared substrates to flexible ones. The most significant built-in challenge in transferring is to control of interface status to accommodate to the disparate nature of the transferred objects from donor wafer/substrate. Distinctive assembly techniques based on stress-induced interface fracture have been invented to be adaptive to the diversity of material properties and geometric sizes that lead to tremendous differences in mechanical properties. For those conventional rigid electronic components like IC chips, they are transferred by standard single-ejector needle pick-and-place It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible subst...

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Laser 3D micro-manufacturing

Cited by 103 publications

References 209 publications

Single‐Shot Laser Additive Manufacturing of High Fill‐Factor Microlens Arrays

Single‐Shot Laser Additive Manufacturing of High Fill‐Factor Microlens Arrays

Micropatterning of poly(p‐phenylene vinylene) by femtosecond laser induced forward transfer

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

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