1989
DOI: 10.1016/0040-6090(89)90473-2
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Laser ablation deposition of titanium nitride films on silicon substrates at room temperature

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Cited by 18 publications
(6 citation statements)
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“…Due to the wide range of applications, TiN films have been grown for decades on a variety of substrates using a broad variety of techniques ranging from chemical vapor deposition [25,26] and atomic layer deposition (ALD) [27] to reactive sputtering [28,29] and pulsed laser deposition (PLD) [30,31], with reactive sputtering being the most common method. For superconducting applications, however, only ALD and reactive sputtering have been widely used, the former mostly for ultrathin, disordered film deposition for the superconductor-insulator studies, and the latter for the detector and qubit applications.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the wide range of applications, TiN films have been grown for decades on a variety of substrates using a broad variety of techniques ranging from chemical vapor deposition [25,26] and atomic layer deposition (ALD) [27] to reactive sputtering [28,29] and pulsed laser deposition (PLD) [30,31], with reactive sputtering being the most common method. For superconducting applications, however, only ALD and reactive sputtering have been widely used, the former mostly for ultrathin, disordered film deposition for the superconductor-insulator studies, and the latter for the detector and qubit applications.…”
Section: Introductionmentioning
confidence: 99%
“…The advantage of the method is a good control of the layer growing process by adjusting of wide set of technology parameters such as: the energy of laser beam, the substrate temperature, the pressure of ambient gas, etc. Thus the method is widely used for layer deposition not only of classical materials (metals, semiconductors) but also such specific compounds like high-temperature superconductors [11][12][13] new metal alloys [14][15][16][17], biocompatible coatings [18,19], laser crystals [20,21] and polymers [22]. The determination of the technology parameters of layer growth is realised either by the theoretical estimation or by in-situ monitoring during the layer deposition by RHEED [23].…”
Section: Introductionmentioning
confidence: 99%
“…1 Due to its excellent properties such as thermodynamic stability, low electrical conductivity, and high hardness, TiN thin films have been widely used as diffusion barriers in microelectronics contracts, 2 wavelength-selective transparent optical coatings, and coatings for high-speed tools. It crystallizes in a cubic NaCl lattice with a lattice constant of 0.42 nm ͑stoichiometric material͒.…”
Section: Introductionmentioning
confidence: 99%
“…1 Due to its excellent properties such as thermodynamic stability, low electrical conductivity, and high hardness, TiN thin films have been widely used as diffusion barriers in microelectronics contracts, 2 wavelength-selective transparent optical coatings, and coatings for high-speed tools. Use of an ArF excimer laser ͑193 nm͒ for the room temperature growth of stoichiometric, crystalline TiN films was reported by Auciello et al 1 Because of the impure bulk TiN target, the films deposited on Si ͑100͒ substrates contained a substantial amount of oxygen and carbon impurities. The conventional methods include: ͑a͒ chemical vapor deposition, 4 ͑b͒ physical vapor deposition such as reactive sputtering of Ti in nitrogen ambient 5 or nitridation of sputtered Ti films, 6 ͑c͒ pulsed laser deposition ͑PLD͒ of pure metal Ti in nitrogen ambient.…”
Section: Introductionmentioning
confidence: 99%
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