2023
DOI: 10.1002/admt.202300516
|View full text |Cite
|
Sign up to set email alerts
|

Laser‐Activated Selective Electroless Plating on 3D Structures via Additive Manufacturing for Customized Electronics

Abstract: This work proposes a facile and economical hybrid additive manufacturing (HAM)technology combining fused deposition modeling (FDM) 3D printing and laser‐activated selective electroless plating (ELP) for fabricating full functional end‐use 3D customized electronics. A functional acrylonitrile butadiene styrene (ABS) filament doped with dicopper hydroxide phosphate (Cu2(OH)PO4) catalysts is developed for FDM 3D printing. The 3D printed structure is selectively laser‐activated to generate CuI plating seeds on the… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
4
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
9

Relationship

3
6

Authors

Journals

citations
Cited by 9 publications
(5 citation statements)
references
References 37 publications
0
4
0
Order By: Relevance
“…Using DLP and ELP procedures to deposit metal layers on the micro-lattice, Shin et al increased the lattice’s compressive rigidity from 8.8 MPa to 11.1 MPa [ 103 ]. To fabricate high-resolution 3D conformal/embedded circuit boards, sensors, antennas, etc., Liu et al integrated laser-activated ELP with a variety of AM technologies [ 104 , 105 , 106 , 107 , 108 ].…”
Section: Embedded Sensors With 3d Printing Technologymentioning
confidence: 99%
“…Using DLP and ELP procedures to deposit metal layers on the micro-lattice, Shin et al increased the lattice’s compressive rigidity from 8.8 MPa to 11.1 MPa [ 103 ]. To fabricate high-resolution 3D conformal/embedded circuit boards, sensors, antennas, etc., Liu et al integrated laser-activated ELP with a variety of AM technologies [ 104 , 105 , 106 , 107 , 108 ].…”
Section: Embedded Sensors With 3d Printing Technologymentioning
confidence: 99%
“…Designing a heterostructure system with a wide light-absorption range and efficient charge carrier mobility is essential for achieving full spectrum solar light utilization . From the aspect of light absorption, narrow bandgap semiconductors such as Cu 2 (OH)­PO 4 , Cu 2 S, Ag 2 S, and BiWO 6 with NIR response are promising to achieve full spectrum absorption. Unfortunately, narrow bandgap semiconductors suffer from low carrier separation efficiency and short carrier lifetime due to the limitation of Coulombic interactions between electrons and holes, limiting the light utilization efficiency. , Very recently, low-dimensional heterostructures including 0D/2D, 1D/2D, and 2D/2D systems , have gained popularity due to the short-range interfacial interaction of two low-dimensional materials, which can promote electronic coupling and electron transfer.…”
Section: Introductionmentioning
confidence: 99%
“…Our group combined laser activated ELP with various AM technologies for the fabrication of high-resolution 3D conformal/embedded circuit boards, sensors, antennas, etc. [ 31 , 32 , 33 , 34 , 35 ].…”
Section: Introductionmentioning
confidence: 99%