Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Ren, Jun; Li, Dongya; Zhang, Yang; Yang, Wenzhen; Nie, Heng‐Yong; Liu, Yu

doi:10.1021/acsaelm.1c01193

Cited by 11 publications

(13 citation statements)

References 53 publications

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“…Figure 1d shows the comparison of the processing time between previously reported laser fabrications [26,[65][66][67][68] and this work for the synthesis of porous graphene with dimensions of 10 × 10, 100 × 100, and 200 × 200 mm 2 . The difference in production time was negligible in the small area of 10 × 10 mm 2 , while a significant decrease of more than 66.5 times was confirmed in large areas of 100 × 100 and 200 × 200 mm 2 .…”

Section: Fpg Fabrication Mechanism By Synergistic Photo-effectsmentioning

confidence: 88%

Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding

et al. 2023

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Porous 2D materials with high conductivity and large surface area have been proposed for potential electromagnetic interference (EMI) shielding materials in future mobility and wearable applications to prevent signal noise, transmission inaccuracy, system malfunction, and health hazards. Here, we report on the synthesis of lightweight and flexible flash-induced porous graphene (FPG) with excellent EMI shielding performance. The broad spectrum of pulsed flashlight induces photo-chemical and photo-thermal reactions in polyimide films, forming 5 × 10 cm2-size porous graphene with a hollow pillar structure in a few milliseconds. The resulting material demonstrated low density (0.0354 g cm−3) and outstanding absolute EMI shielding effectiveness of 1.12 × 105 dB cm2 g−1. The FPG was characterized via thorough material analyses, and its mechanical durability and flexibility were confirmed by a bending cycle test. Finally, the FPG was utilized in drone and wearable applications, showing effective EMI shielding performance for internal/external EMI in a drone radar system and reducing the specific absorption rate in the human body.

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Section: Fpg Fabrication Mechanism By Synergistic Photo-effectsmentioning

confidence: 88%

Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding

et al. 2023

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Section: Dlw Principles For Electronics Microfabricationmentioning

confidence: 99%

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Pinheiro,

Morais,

Silvestre

et al. 2024

Advanced Materials

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Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost‐effective, high‐resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, we survey and outline recent advances and strategies based on DLW for electronics microfabrication, based on laser material growth strategies. First, we summarize the main DLW parameters influencing material synthesis and transformation mechanisms, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser‐induced graphene, and their mixtures. By accessing a wide range of material types, DLW‐based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next‐generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.This article is protected by copyright. All rights reserved

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“…Third, Anderetta et al reported that the PAA solution showed feasibility for epoxy resin, but there was the most peeled metal observation along the grid lines among these studies [19]. Lastly, Ren et al have suggested the KNaC 4 H 4 O 6 solution for electroless plating on PI due to its verified excellent adhesive strength of 5B [20].…”

Section: Adhesion Strength Between Pekk-ni Coatingmentioning

confidence: 99%

Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs

et al. 2022

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PEKK (polyether-ketone-ketone) polymer has been actively studied in applying electronic devices in satellites owing to its excellent light weight and thermal resistance. However, the limitation of metal coating to form on the PEKK surface is due to the high-volume resistivity and surface resistance. Here, we have investigated the correlations between the chemical treatment of the surface and adhesion strength between polymer–metal coating. Three-dimensional printed PEKK objects were manufactured and nickel was deposited on the surface by electroless plating. As the concentration of H2SO4 increased from 12.5 to 14.3 mol/L, the pore diameter showed a tendency to increase. However, as growing pore induced connecting each other, the pore size re-decreased from 15.1 to 18.0 mol/L. To control pore size and uniformity, we investigated the pore diameter of 3D printed PEKK as a function of treatment time and temperature. Uniform pores were observed at a temperature of 50 °C which were formed after 10 min and the average pore size was 0.28. After H2SO4 swelling, samples were re-treated in the KMnO4-H3PO4 etching system for the hydrophilic group. KMnO4 broken C=C bonding and generated hydrophilic groups such as -COOH and -OH, the contact angle decreased from 64.7 to 51.1° compared with H2SO4 swelling. XPS survey spectra confirmed that not only breaking C=C bonding but also increasing hydrophilicity due to -OH, -C-, -SO3 and the catalyst absorption of Pd was improved. As a result of adhesive strength by ASTM D3359, compared with the H2SO4 swelling, the KMnO4-H3PO4 etching system showed 5B which is the best result in standard test methods by adhesive tape test and peeling amount on the tape was less than 0.01%.

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Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Cited by 11 publications

References 53 publications

Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding

Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs

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