Laser direct etching of silicon on oxide for rapid prototyping

Abstract

Structures have been etched in poly-silicon and amorphous silicon deposited on silicon oxide by laser direct writing. These patterns can be written with a high resolution and transferred to the underlying material via reactive ion etching. Three-dimensional structures can be obtained by multiple exposure of the silicon mask. Due to the fast turnaround time of direct writing processes, this technique can be applied for rapid prototyping of large-scale structures.

Topology design optimization of dielectric substrates for bandwidth improvement of a patch antenna

“…A key aspect of the design approach is its practicality. That is, once the mixing formula is mathematically developed, we can then proceed to manufacture it using standard extrusion or machining processes, solid free-form fabrication or rapid prototyping using a linear micro-machining system [18].…”

Fabrication and characterization of truly 3-D diffuser/nozzle microstructures in silicon

“…1(b). The total pressure drop in nozzle direction can hence be written as (5) where is the loss coefficient of the nozzle. …”

“…2(a)]. Openings corresponding to the desired via holes are etched into the polysilicon applying laser-assisted etching as described by Müllenborn et al [5] [ Fig. 2(b)].…”

Evaluation of a rapid prototyping process for microsystems for silicon microstructures

“…This is supported by the proposed concept, as there is no need for a time-consuming and expensive photomask fabrication. Moreover, the concept is less expensive, quicker and more flexible than other approaches [2,3].…”

“…This makes a difference to other laser-supported etching techniques [2,3] which require special gases supporting the removal. After the structuring of the platinum layer there still is a platinum-silizide layer on the surface which has to be removed by hydrofluoric acid (HF).…”