Laser direct sintering approach for additive manufacturing in flexible electronic

Mu, Boyu; Wang, Xuepei; Zhang, Xiaoshuan; Xiao, Xinqing

doi:10.1016/j.rineng.2022.100359

Cited by 18 publications

(5 citation statements)

References 10 publications

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“…Among the Cu lines, the narrowest line width of Cu is found near the AFL of the laser, and we observed various defects in the Cu patterns and on the PI film. Similar to previous reports 21 – 23 , the most common defects are line defects, which are empty or perforated areas in the middle of patterned Cu lines. We found that defective patterns appear differently along with up and down directions from the AFL.…”

Section: Resultssupporting

confidence: 87%

“…However, lowering the flash intensity to mitigate this risk will reduce the sinter quality. Moreover, this method is not a direct patterning method, and an additional patterning process is required before and after Cu sintering.Another promising technique is direct laser sintering [22][23][24][25][26][27] . During focus, the focused beam energy is absorbed by the precursor and induces a localized, transient heating process that results in rapid sintering.…”

mentioning

confidence: 99%

“…Another promising technique is direct laser sintering [22][23][24][25][26][27] . During focus, the focused beam energy is absorbed by the precursor and induces a localized, transient heating process that results in rapid sintering.…”

mentioning

confidence: 99%

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Copper laser patterning on a flexible substrate using a cost-effective 3D printer

Chakraborty

Park

Ahn

2022

Sci Rep

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We studied the cost effective direct laser patterning of copper (Cu) on thin polyimide substrates (PI thickness: 12.5–50 µm) using a 405 nm laser module attached to an inexpensive 3D printer. The focal length of the laser was intentionally controlled to reduce defects on patterned Cu and surface damage of PI under predetermined process conditions. The appropriate focal length was examined at various focal distances. Focal distances of − 2.4 mm and 3 mm were found for the shorter focal length (SFL) and longer focal length (LFL), respectively, compared to the actual focal length. This resulted in clean Cu line patterns without line defects. Interestingly, the SFL case had a different Cu growth pattern to that of LFL, indicating that the small difference in the laser incident angle could affect Cu precursor sintering. Cu square patterns had a lower resistivity of 70 μΩ·cm for an LFL after three or four laser scans, while the SFL showed a resistivity below 48 μΩ·cm for a one-time laser scan. The residues of the Cu precursor on PI were easily removed with flowing water and normal surfactants. However, the resistivity of the patterns decreased after cleaning. Among the scan gaps, the Cu square pattern formed at a 70 μm scan gap had the lowest sheet resistance and the least change in resistance from around 4 to 4.4 Ω/ϒ after cleaning. This result implies that the adhesion of the patterned Cu could be improved if the coated Cu precursor was well sintered under the proper process conditions. For the application of this method to bioelectronics, including biosensors, LEDs were connected to the Cu patterns on PI attached to the arm skin and worked well, even when the substrate PI was bent during power connecting.

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Section: Resultssupporting

confidence: 87%

mentioning

confidence: 99%

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Copper laser patterning on a flexible substrate using a cost-effective 3D printer

Chakraborty

Park

Ahn

2022

Sci Rep

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“…This innovative approach offers several advantages, including the ability to create customized, lightweight, and geometrically complex electronics with reduced material waste and shorter production cycles [245]. It has the potential to revolutionize various industries, including the aerospace [246], automotive [247], healthcare [248], and consumer electronics industries [249], by enabling the rapid prototyping and on-demand manufacturing of electronic devices, sensors, wearables, and IoT (Internet of Things) components. As this technology continues to advance, it holds the promise of transforming the way in which electronic devices are designed and manufactured.…”

Section: Additively Manufactured Electronicsmentioning

confidence: 99%

Recent Inventions in Additive Manufacturing: Holistic Review

Fidan,

Huseynov,

Ali

et al. 2023

Inventions

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This general review paper presents a condensed view of recent inventions in the Additive Manufacturing (AM) field. It outlines factors affecting the development and commercialization of inventions via research collaboration and discusses breakthroughs in materials and AM technologies and their integration with emerging technologies. The paper explores the impact of AM across various sectors, including the aerospace, automotive, healthcare, food, and construction industries, since the 1970s. It also addresses challenges and future directions, such as hybrid manufacturing and bio-printing, along with socio-economic and environmental implications. This collaborative study provides a concise understanding of the latest inventions in AM, offering valuable insights for researchers, practitioners, and decision makers in diverse industries and institutions.

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“…Therefore, the post-processing sintering step is important to build a metal-to-metal contact for desired electrical conductivity. Sintering of printed patterns is generally performed with thermal [30,31], intense pulsed light [32,33], plasma [24,34,35], electrical [36,37] and laser sintering processes [38][39][40][41][42][43]. Thermal sintering is not suitable for many polymer substrates since they are highly sensitive to heat.…”

Section: Introductionmentioning

confidence: 99%

Ultrashort laser sintering of printed silver nanoparticles on thin, flexible, and porous substrates

Sharif

Farid

McGlynn

et al. 2023

J. Phys. D: Appl. Phys.

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The fabrication of low-cost and mechanically robust flexible electronic patterns has increasingly gained attention due to their growing applications in flexible displays, touch screen panels, medical devices, and solar cells. Such applications require cost-effective deposition of metals in a well-controlled manner potentially using nanoparticles (NPs). The presence of solvent and precursors in NP based inks impacts the electrical conductivity of the printed pattern and a post-processing heating step is typically performed to restore the electrical properties and structure of the material. We report printing with picolitre droplet volumes of silver (Ag) NPs on flexible substrates using an acoustic microdroplet dispenser. The low-cost, controlled deposition of Ag ink is performed at room temperature on photopaper, polyimide and clear polyimide substrates. A localized, ultrashort pulsed laser with minimal heat affected zone is employed to sinter printed Ag patterns. For comparison, oven sintering is performed, and the results are analysed with scanning electron microscopy, four-point probe and Hall measurements. The femtosecond laser sintering revealed highly organized, connected nanostructure that is not achievable with oven heating. A significant decrease in sheet resistance, up to 93% in Ag NPs on clear polyimide confirms the laser sintering improves the connectivity of the printed film and as a result, the electrical properties are enhanced. The surface morphology attained by the laser sintering process is interpreted to be due to a joining of NPs as a result of a solid-state diffusion process in the near surface region of NPs.

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Laser direct sintering approach for additive manufacturing in flexible electronic

Cited by 18 publications

References 10 publications

Copper laser patterning on a flexible substrate using a cost-effective 3D printer

Copper laser patterning on a flexible substrate using a cost-effective 3D printer

Recent Inventions in Additive Manufacturing: Holistic Review

Ultrashort laser sintering of printed silver nanoparticles on thin, flexible, and porous substrates

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