Laser Direct Write micro-fabrication of large area electronics on flexible substrates

Zacharatos, Filimon; Makrygianni, Marina; Geremia, R.; Biver, Emeric; Karnakis, Dimitris; Leyder, S.; Puerto, D.; Delaporte, Philippe; Zergioti, I.

doi:10.1016/j.apsusc.2015.10.066

Cited by 40 publications

(27 citation statements)

References 24 publications

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“…The in-depth profile graphs of Figure 9 clearly indicate the high in-depth selectivity of the reported transfer process (heat affected zone restricted to around 100 nm), which relies on heating by short laser pulses (10 ns pulse width). As reported also in previous works [ 25 ], nanosecond pulsed lasers are a very efficient and selective tool for the sintering or curing of metal nanostructures. In the current experiment, lateral selectivity is also highlighted, owing to the sparse distribution of the Ag NWs on the x-y plane (see Figure 8 ).…”

Section: Resultssupporting

confidence: 66%

“…In effect, the laser induced transfer of solid pixels with complex geometries [ 22 ], nanopatterned structures [ 23 ] and even multi-stacked layers with opto-electronic functionality [ 24 ], have been demonstrated over the past decade, highlighting the versatility of the laser induced transfer technology for the digital fabrication of structures and devices with resolutions down to 1 μm. In addition, the authors in previous reports have demonstrated the employment of Laser Direct Writing for the digital fabrication of highly conductive microelectrodes [ 25 ] and low-loss Radio Frequency (RF) transmission lines with resolutions down to 1 μm [ 26 ], using Ag nanoparticle ink dispersions. Other papers of the reporting group have clearly shown the applicability of the LIFT process for the direct transfer of intact solid pixels of organic semiconducting materials [ 27 , 28 ] and flakes of 2D layered materials [ 29 ].…”

Section: Introductionmentioning

confidence: 99%

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Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

et al. 2018

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Ag nanowire (NW) networks have exquisite optical and electrical properties which make them ideal candidate materials for flexible transparent conductive electrodes. Despite the compatibility of Ag NW networks with laser processing, few demonstrations of laser fabricated Ag NW based components currently exist. In this work, we report on a novel single step laser transferring and laser curing process of micrometer sized pixels of Ag NW networks on flexible substrates. This process relies on the selective laser heating of the Ag NWs induced by the laser pulse energy and the subsequent localized melting of the polymeric substrate. We demonstrate that a single laser pulse can induce both transfer and curing of the Ag NW network. The feasibility of the process is confirmed experimentally and validated by Finite Element Analysis simulations, which indicate that selective heating is carried out within a submicron-sized heat affected zone. The resulting structures can be utilized as fully functional flexible transparent electrodes with figures of merit even higher than 100. Low sheet resistance (<50 Ohm/sq) and high visible light transparency (>90%) make the reported process highly desirable for a variety of applications, including selective heating or annealing of nanocomposite materials and laser processing of nanostructured materials on a large variety of optically transparent substrates, such as Polydimethylsiloxane (PDMS).

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Section: Resultssupporting

confidence: 66%

Section: Introductionmentioning

confidence: 99%

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

et al. 2018

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“…After the laser printing process is over, a sintering process is required so that the copper ink patterns obtain the desired electrical properties. In this work we have employed laser sintering for selective and high resolution heating of the nanoparticles, as it is extensively described in previous works [9][10][11]. First the printed ink dries in ambient atmosphere for a few minutes at room temperature, then the sintering procedure takes place with the direct exposure of the pattern to the laser beam ( Fig.…”

Section: Lift and Laser Sintering: Process And Setupmentioning

confidence: 99%

“…One of the most widely used additive micro-manufacturing technologies relies on the direct printing followed by selective sintering of metal nanoparticle inks. Laser printing relying on the Laser Induced Forward Transfer (LIFT) technique, combined with selective laser sintering stand out among the additive micro-manufacturing technologies [3][4][5] owing to the high speed (>1 m/s) and high resolution (<50 µm) [6], as well as the lateral selectivity and minimized heat affected zone with demonstrations of highly conductive micro-patterns in flexible electronic applications [7][8][9][10][11]. In this technology, inks comprising metals like gold and silver have been primarily employed due to their high conductivity and environmental stability [12].…”

Section: Introductionmentioning

confidence: 99%

Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits

Koritsoglou

Theodorakos

Zacharatos

et al. 2019

Opt. Mater. Express

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Recent advances in flexible electronics have highlighted the importance of high throughput, digital additive microfabrication techniques. In this work, we demonstrate the combination of laser printing and laser sintering of a novel copper nanoparticle ink onto flexible substrates in order to produce oxide free conductive copper patterns in ambient atmospheric conditions. The printed patterns exhibit high reproducibility, very low resistivity (about 2x bulk), and negligible oxidation according to Raman spectroscopy. The process has been employed for the fabrication of an on-chip antenna on a flexible substrate for use in combination with a flexible circuit, in applications where a small form factor and simplicity of integration are required alongside ultra-low cost, e.g. consumable tagging.

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“…In LIFT, the receiver substrate does not need to be rigid so that flexible substrates such as polymers or paper can be employed as well. [ 25–32 ] In contrast to IJP, the absence of nozzle sets almost no restriction on the rheological properties of the ink. Several studies have proved the feasibility of LIFT for printing liquids with a wide range of viscosities (from 1 to 10 6 mPa s), [ 33–35 ] and suspensions containing large loading particles (up to 30 µm).…”

Section: Introductionmentioning

confidence: 99%

Laser‐Induced Forward Transfer: A Digital Approach for Printing Devices on Regular Paper

Sopeña

Sieiro

Fernández-Pradas

et al. 2020

Adv Materials Technologies

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Inkjet printing (IJP) is the most widespread direct‐write technique in paper electronics. However, this technique cannot be used for printing devices on untreated regular paper, since its low‐viscosity nanoinks leak through the cellulose fibers. Thus, a planarization coating is frequently used as a barrier, even though this makes substrates more expensive and less eco‐friendly. Alternatively, high solid content screen printing (SP) inks could allow printing on regular paper due to their high viscosity and large particle size; however, they cannot be printed through IJP. Another digital technique is then required: laser‐induced forward transfer (LIFT). This work aims at proving the feasibility of LIFT for printing devices on regular paper. The main transfer parameters are systematically varied to obtain uniform Ag‐SP interconnects, whose performance is improved by a multiple‐printing approach. It results in low resistances with much better performance than those typical of IJP. After optimizing the functionality of the printed lines, a proof‐of‐concept consisting of a radio‐frequency inductor is provided. The characterization of the device shows a substantially higher performance than that of the same device printed with IJP ink in similar conditions, which proves the potential of LIFT for digitally fabricating devices on regular paper.

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Laser Direct Write micro-fabrication of large area electronics on flexible substrates

Cited by 40 publications

References 24 publications

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits

Laser‐Induced Forward Transfer: A Digital Approach for Printing Devices on Regular Paper

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