Laser embedding electronics on 3D printed objects

Abstract

Additive manufacturing techniques such as 3D printing are able to generate reproductions of a part in free space without the use of molds; however, the objects produced lack electrical functionality from an applications perspective. At the same time, techniques such as inkjet and laser direct-write (LDW) can be used to print electronic components and connections onto already existing objects, but are not capable of generating a full object on their own. The approach missing to date is the combination of 3D printing processes with direct-write of electronic circuits. Among the numerous direct write techniques available, LDW offers unique advantages and capabilities given its compatibility with a wide range of materials, surface chemistries and surface morphologies. The Naval Research Laboratory (NRL) has developed various LDW processes ranging from the non-phase transformative direct printing of complex suspensions or inks to lase-and-place for embedding entire semiconductor devices. These processes have been demonstrated in digital manufacturing of a wide variety of microelectronic elements ranging from circuit components such as electrical interconnects and passives to antennas, sensors, actuators and power sources. At NRL we are investigating the combination of LDW with 3D printing to demonstrate the digital fabrication of functional parts, such as 3D circuits. Merging these techniques will make possible the development of a new generation of structures capable of detecting, processing, communicating and interacting with their surroundings in ways never imagined before. This paper shows the latest results achieved at NRL in this area, describing the various approaches developed for generating 3D printed electronics with LDW.

Additive Manufacturing of Materials: Viable Techniques, Metals, Advances, Advantages, and Applications

“…Figure 5.13 shows hybrid sensor platforms with printed, embedded, or bonded sensors, actuators, microprocessors, communication components, energy harvester devices, and signal-processing circuitry that are enabling new applications with capabilities extending beyond the scope of conventional materials and integration approaches. [122][123][124][125][126][127][128][129][130][131][132][133] Embedded sensors in 3D custom-shaped structures and packaging configurations enabled by additive manufacturing and printed electronics offer continuous monitoring, significantly impacting the productivity, reliability, and safety aspects critical for technology integration. Passive conductive structures including circuit layouts and interconnect structures can be printed conformally on the substrate of interest and post-processed to achieve the desired functionality.…”

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

“…Besides, laser-induced metallization was also proposed to achieve high-resolution conductive patterns on the 3D-printed polymers from Pd-embedded polymers. 16,17 Nevertheless, Pd is a rare and expensive catalyst material, 18 which can limit the cost-effective and large-scale utilization of these techniques. As an alternative to the Pd seeding, some studies employed conductive pastes (e.g., silver (Ag) paste) followed by electroless deposition (ED) to create structural polymer electronics with high electrical conductivity (42.6 × 10 6 S m −1 ).…”

“…To address the poor conductivity of the conductive thermoplastic filaments, catalyst-embedded filaments were proposed for 3D-printed parts followed by electroless or electrodeposition. − This approach enabled area-selective metallization and led to a significant improvement in electrical conductivity (i.e., 44.4 × 10 6 S m –1 ) as compared to the bare carbon black filaments. Besides, laser-induced metallization was also proposed to achieve high-resolution conductive patterns on the 3D-printed polymers from Pd-embedded polymers. , Nevertheless, Pd is a rare and expensive catalyst material, which can limit the cost-effective and large-scale utilization of these techniques. As an alternative to the Pd seeding, some studies employed conductive pastes (e.g., silver (Ag) paste) followed by electroless deposition (ED) to create structural polymer electronics with high electrical conductivity (42.6 × 10 6 S m –1 ) .…”

The Design of 3D-Printed Lattice-Reinforced Thickness-Varying Shell Molds for Castings

“…3D printing technology has already been applied in the foundry industry [9,10,11,12,13]. Kang et al presented new mold structures, which contain a mold shell, with functional structures and an enforced skeleton [14,15,16].…”