Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates

Marinov, V.; Swenson, Orven F.; Miller, R.J.; Sarwar, Ferdous; Atanasov, Yuriy; Semler, Matthew R.; Datta, Samali

doi:10.1109/tcpmt.2011.2176941

Cited by 54 publications

(27 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…This may be a reminder that for a thinner (e.g., <30-μm thickness) and larger (e.g., >10 mm × 10 mm) chip, multineedle process is potential to be failure to start the peeling unless increasing the needle force. To resolve the two conflicting issues, namely, improving peeling ERR and restraining die cracking stress, it may need to develop a revolutionary pick and place technology, such as laser-induced forward transfer [24]- [27].…”

Section: Discussionmentioning

confidence: 99%

Reliable Peeling of Ultrathin Die With Multineedle Ejector

Liu

Huang

Liu

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

Flip chip packaging as a mainstream packaging interconnect technology has proliferated rapidly within the last decade or so. With the applications of high-performance chip, its thickness and size have been much thinner and bigger, which is challenging the current assembly technique, especially for the reliable peeling of ultrathin die from the wafer due to its vulnerability and flexibility. Here, we present some significant analytical formulas to estimate die cracking stress and peeling energy in die peeling process. The effects of two factors, including peeling cracking propagation and ejecting needle configuration, are investigated using a fracture mechanics framework. Meanwhile, all analytical predictions have been verified via finite element modeling with virtual crack technique. Theoretical results have shown that die cracking stress could be effectively reduced, but it rarely works to improve peeling energy when more needles are embedded below the adhesive tape. In particular, the essence of the technique with the multineedle is discussed, compared with the normal single-needle technique, which can be used to guide the design of ultrathin die peeling process.Index Terms-Adhesive layer, chip peeling-off, die-cracking stress, energy release rate (ERR), microelectronic packaging, multineedle ejector.

show abstract

Section: Discussionmentioning

confidence: 99%

Reliable Peeling of Ultrathin Die With Multineedle Ejector

Liu

Huang

Liu

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

show abstract

“…3. The following sections explain in detail the steps in this process, which has been successfully applied to fabricate a prototype passive RFID tag with an embedded ultrathin RFID chip in what would be the first technology demonstration reported in the literature of a functional electronic device packaged using a contactless laser-induced forward transfer method [35].…”

Section: Methodsmentioning

confidence: 99%

“…The force exerted by the blister, in addition to the gravitational force of the die, initiates the transfer over the gap. More details about tmSLADT are available elsewhere [35][36][37].…”

Section: Thermo-mechanical Selective Laser Assisted Die Transfermentioning

confidence: 99%

Laser-assisted ultrathin die packaging: Insights from a process study

Marinov

Swenson

Atanasov

et al. 2013

Microelectronic Engineering

Self Cite

View full text Add to dashboard Cite

“…Once placed on the DRL, the µLEDs are ready for laser transfer, accomplished using Uniqarta's patented laser transfer process for high-rate assembly of ultra-small and/or ultra-thin semiconductor dies [9] modified for µLED placement and illustrated in Figure 2.…”

Section: Mplet Technology For Component Placementmentioning

confidence: 99%

52‐4: Laser‐Enabled Extremely‐High Rate Technology for µLED Assembly

Marinov

2018

Symp Digest of Tech Papers

View full text Add to dashboard Cite

We developed a complete wafer-to-panel technology for extremely high rate assembly of µLEDs. The process involves transferring the µLEDs directly from the source epi-wafer to a quartz carrier from where they are selectively transferred to the panel using our Laser-Enabled Massively Parallel Transfer method with >100M units/hr. Author KeywordsµLED assembly; massively-parallel transfer; µLED display.

show abstract

Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates

Cited by 54 publications

References 39 publications

Reliable Peeling of Ultrathin Die With Multineedle Ejector

Reliable Peeling of Ultrathin Die With Multineedle Ejector

Laser-assisted ultrathin die packaging: Insights from a process study

52‐4: Laser‐Enabled Extremely‐High Rate Technology for µLED Assembly

Contact Info

Product

Resources

About