Laser frequency combination tuning and locking technology in resonant optical gyro

Yin, Shihao; Liu, Wenyao; Pan, Ziwen; Tao, Yu; Zhu, Jiangbo; Tang, Jun; Liu, Jun

doi:10.1007/s00340-020-07421-8

Cited by 7 publications

(1 citation statement)

References 22 publications

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“…Its minor response leads to the deviation of the working central frequency and then causes a fatal impact on the working stability of the laser gyro. One method to stabilize the working central frequency is to adjust the medium refractive index in the cavity such as the temperature compensation method [ 5 , 6 , 7 , 8 ]. Another frequency stabilization method is to adjust the length of the resonant cavity directly, where piezoelectric transducer wafers are usually used in a pair to drive the mobilizable mirror in the ring resonant cavity [ 9 , 10 , 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Automatic Sorting System for Rigid Piezoelectric Transducer Wafers Used in Displacement Adjustment

Ren

Wang

et al. 2020

Micromachines

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Piezoelectric transducer wafers are usually used in pairs to adjust the resonant cavity length of the ring laser gyro. In practice, the paired wafers are required to have similar piezoelectric charge coefficient d31. To handle the pairing operation in-batch, an automatic sorting system was developed on the basis of deformation measurement, which adopted a frame of a Cartesian-coordinate robot. The wafers were self-aligned in the vertical direction, and a vacuum holder was used to pick up, transfer, and then place them on thee testing desk one by one. The excitation voltage was loaded on the wafer by a specifically designed electrode, and the resulting micro deformation was measured by dual opposite inductive micrometers using the relative measurement principle. This particular electrode has the function of attitude self-adjustment and vacuum adsorption, which is conducive to loading the voltage reliably and protecting the wafer from undesired damage. Finally, the wafers were transported to different stock bins based on the measuring results. This system is suited to handle a mass of wafers by continuous processing on site for its high reliability and measurement consistency. The measurement accuracy, validated by laser interferometry, was better than 0.5 μm and the repeatability was superior to 0.1 μm.

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