Laser-induced deposition of Ni lines on ferrite in NiSO4 aqueous solution

Lu, Yongfeng; Takai, M.; Nakata, Toshiyuki; Nagatomo, S.; Namba, Susumu

doi:10.1007/bf00323729

Cited by 26 publications

(5 citation statements)

References 9 publications

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“…Our previous studies developed several effective methods for microfabrication of magnetic head structures: laser-induced microetching of Mn-Zn ferrite in a CC14 gas atmosphere or in a H3PO4 aqueous solution [5][6][7][8], laser-induced deposition of buried SiO2 line in Mn-Zn ferrite [9], and direct writing of Ni-lines on a ferrite surface by laser-induced thermal decomposition of NiSO4 [10]. The microprocessing with high process-rate, high precision and low damage is being required with the increase in recording capacity.…”

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confidence: 99%

Direct writing of Ag-lines on Mn-Zn ferrite by laser-induced thermal decomposition by CH3COOAg

Takai

Nagatomo

et al. 1992

Appl. Phys. A

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Laser-induced direct writing of silver lines on a ferrite surface from a silver acetate (CH3COOAg) thin layer has been investigated. The deposition is a thermochemical process and the threshold temperature for thermal decomposition of CH3COOAg is about 380 ° C. About 100% of Ag in the deposited lines has been achieved. The width of the deposited Ag-lines increased with the increase in laser power, and it can be accurately estimated by the temperature profile induced by laser irradiation within the power region below the melting point of ferrite. A line thickness of micron order can be formed both on a ferrite surface and on a deposited SiO2 surface, whereas the line width decreased with the increase in beam dwell time due to the vaporization of both CH3COOAg precursor and deposited Ag material.

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confidence: 99%

Direct writing of Ag-lines on Mn-Zn ferrite by laser-induced thermal decomposition by CH3COOAg

Takai

Nagatomo

et al. 1992

Appl. Phys. A

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“…We assume that local melting at narrow junctions between two copper crystals is the reason of the fluctuation and afterwards of the slightly higher conductivity value. The found mean value of 1.4x10 7 1/(Ω*m) with a standard deviation of 0.4x10 7 1/(Ω*m) corresponds approximately to a quarter of the specific conductivity of bulk copper. The conductivity remained stable after storage under ambient conditions for months.…”

Section: Conductivitymentioning

confidence: 78%

“…In addition the components are affordable and easy to handle. LCLD is a wellknown technique and is applied for a long time already [1][2][3][4][5][6][7][8][9]. In recent work, our group investigated an ablation technique called laser induced backside wet etching (LIBWE) [10,11].…”

Section: Introductionmentioning

confidence: 99%

Laser-induced chemical liquid-phase deposition of copper on transparent substrates

Zehnder

Schwaller

Arx

et al. 2012

ALT

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Laser-induced chemical liquid phase deposition allows maskless manufacturing of metallic structures on the surface of dielectrics and is prospected to be a promising tool in the field of microelectronics and microfluidics. The aim of the work presented here is to combine this deposition method with a related micro-structuring method known as laser-induced backside wet etching. Fabricating both, microstructured surface structures and subsequent deposition of conducting patterns within the same setup would be an interesting tool for rapid prototyping.To demonstrate the functional principle of this combined approach conductive copper lines were deposited at the backside of both polished and structured soda lime glass substrates by using a focused, scanning ns-pulsed Ytterbium fiber laser at 532nm wavelength. The deposition process is initiated by a photo induced reaction of a CuSO4-based liquid precursor in contact with the backside of the substrate. The obtained metallic copper deposits are crystalline, stable under ambient conditions and have a conductivity in the same order of magnitude as bulk copper.

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“…This method can be further classified into laser-induced deposition (LID) and selective laser sintering (SLS). In LID processes, the substrate is placed in contact with a liquid or gas metalorganic precursor, and localized deposition is initiated with a focused laser beam at the precursor-substrate interface. , The LID process has been used for the deposition of a wide range of metals such as Cu, Ni, Au, and Ag on several kinds of hard and flexible polymeric substrates such as polyimide (PI). − However, the high reactivity and toxicity of the precursors have made this processes impractical for scalable manufacturing. An alternative LID method, referred to as laser-induced forward transfer (LIFT) or laser driven release, uses laser imparted energy to transfer materials from a transparent supporting substrate onto an acceptor substrate. , The heat induced by the laser beam changes the phase of the film on the supporting substrate providing the propulsion required to drive the material from the holder onto the receiving substrate.…”

Section: Introductionmentioning

confidence: 99%

Direct Laser Writing of Porous-Carbon/Silver Nanocomposite for Flexible Electronics

Rahimi

Ochoa

Ziaie

2016

ACS Appl. Mater. Interfaces

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In this Research Article, we demonstrate a facile method for the fabrication of porous-carbon/silver nanocomposites using direct laser writing on polymeric substrates. Our technique uses a combination of CO2 laser-induced carbonization and selective silver deposition on a polyimide sheet to create flexible highly conductive traces. The localized laser irradiation selectively converts the polyimide to a highly porous and conductive carbonized film with superhydrophilic wettability. The resulting pattern allows for selective trapping of aqueous silver ionic ink solutions into the carbonized regions, which are converted to silver nanoparticle fillers upon an annealing step. Elemental and surface morphology analysis via XRD and SEM reveals a uniform coating of Ag nanoparticles on the porous carbon. The Ag/C composite lowers the sheet resistance of the original laser carbonized polyimide from 50 to 0.02 Ω/□. The resulting patterns are flexible and electromechanically robust with less than 0.6 Ω variation in resistance after >15000 bending flexion cycles at a radius of curvature of 5 mm. Furthermore, using this technique, we demonstrate the fabrication of a wireless resonant pressure sensor capable of detecting pressures ranging from 0 to 97 kPa with an average sensitivity of -26 kHz/kPa.

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Laser-induced deposition of Ni lines on ferrite in NiSO4 aqueous solution

Cited by 26 publications

References 9 publications

Direct writing of Ag-lines on Mn-Zn ferrite by laser-induced thermal decomposition by CH3COOAg

Direct writing of Ag-lines on Mn-Zn ferrite by laser-induced thermal decomposition by CH3COOAg

Laser-induced chemical liquid-phase deposition of copper on transparent substrates

Direct Laser Writing of Porous-Carbon/Silver Nanocomposite for Flexible Electronics

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