The paper is a report on a newly developed material
and on technological studies which open up new methods for the combined application of laser and
computer technology for advanced industrial applications, e.g., for the laser direct imaging of
conducting paths, circuit structures in printed circuit boards and probably also in moulded
interconnection devices. The process uses — instead of copper and
photoresists — layers of a special polymer poly(bis‐alkylthio‐acetylene),
PATAC, in which leads or conducting organic structures will be written by laser‐induced local
conversion of PATAC into conductive polymer tracks. The organic leads obtained can be reinforced
by electroplating if necessary. It is a purely additive process, which works without etching, thus
avoiding environmental problems. The new material and technology also allow the direct imaging of
resistors, capacitors and inductors on to printed circuit boards and make it possible to make chips and
other electronic components conductive. It enables the production of leads in the 10 μm scale and
for this reason is suitable for hybrid technology. The new technology is not restricted to one plane and
can, therefore, also be used for 3‐D boards or MIDs.