Laser-induced high-quality etching of fused silica using a novel aqueous medium

Ding, Ximing; Kawaguchi, Yuji; Niino, Hiroyuki; Yabe, Akira

doi:10.1007/s00339-002-1453-1

Cited by 64 publications

(42 citation statements)

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“…More recent developments in LDWϪ include chemically assisted techniques such as laser-drilling ceramics or biomaterials and laser-induced backside wet etching (LIBWE) of glass. 12,13 In fact, one may also consider laser cleaning to be a controlled LDWϪ process. 14 The fundamental interactions leading to material removal can be thermal or athermal, depending primarily on the material/environment characteristics and the pulse duration of the laser.…”

Section: Laser Direct-write Subtraction (Ldw-)mentioning

confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

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Direct-write techniques enable computer-controlled two-and three-dimensional pattern formation in a serial fashion. Among these techniques, the versatility offered by laser-based direct-write methods is unique, given their ability to add, remove, and modify different types of materials without physical contact between a tool or nozzle and the material of interest. Laser pulses used to generate the patterns can be manipulated to control the composition, structure, and even properties of individual three-dimensional volumes of materials across length scales spanning six orders of magnitude, from nanometers to millimeters. Such resolution, combined with the ability to process complex or delicate material systems, enables laser direct-write tools to fabricate structures that are not possible to generate using other serial or parallel fabrication techniques. The goal of the articles in this issue of MRS Bulletin is to illustrate the range of materials processing capabilities, fundamental research opportunities, and commercially viable applications that can be achieved using recently developed laser direct-write techniques. We hope that the articles provide the reader with a fresh perspective on the challenges and opportunities that these powerful techniques offer for the fabrication of novel devices and structures.

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Section: Laser Direct-write Subtraction (Ldw-)mentioning

confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

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“…The first one is that the fluence -etch rate graphs can be fitted by two straight lines. This behavior was observed by many research groups [13][14][27][28][29][30][31][32], but correct, coherent explanation have not existed yet. We have already presented a LIBWE model in our previous papers [15,27], which gave relatively good results for LIBWE applying ArF laser (nevertheless the calculated threshold fluence was higher than the measured one), but this model did not work for KrF experiments, namely etching was not predicted in the applied fluence range (up to ≈2 J/cm 2 ).…”

Section: Introductionmentioning

confidence: 81%

“…These layers can be identified as the modified layers, although these thicknesses were overestimated by the calculations. This residual melted and quickly refrozen layer might answer the question, how the modified layer is reproduced from pulse to pulse: the carbon (originate from the organic liquid molecules due to the high energy UV photons) probably can build in the upper part of the residual melted fused silica layer (by diffusion and/or due to the high pressure in the liquid [27,29,38]). …”

Section: Numerical Model and Discussionmentioning

confidence: 99%

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Vass

Budai

Schay

et al. 2010

JLMN

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Laser-induced backside wet etched fused silica surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and ellipsomerty, and a new numerical model was developed to interpret the etching procedure on the basis of our recent results. ArF and KrF lasers were used for etching, while the applied liquid absorbers were naphthalene/methyl-methacrylate and pyrene/acetone solutions. The XPS measurements showed that the completely cleaned, etched fused silica surface layers were contaminated by carbon (which originated from the organic absorber molecules). The optical parameters of the modified layers were measured by spectroscopic ellipsometer. The thicknesses of these carbon contaminated layers were very thin (between 10 and 30 nm), while their absorption coefficient and the refractive index at 248 nm were between 100 000 and 180 000 cm -1 , and 1.85, respectively. Our previous numerical model was completed on the basis of the determined properties of this modified layer, and our results proved that this layer plays key role in the etching procedure.

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“…The organic solution for a laser absorber was an aqueous naphthalene solution (dye concentration: 0.4 mol dm -3 ). 14) It is possible to fabricate a deep micro-trench about 7 μm wide and 420 μm deep on silica glass with a maximum aspect ratio of 60 by LIBWE with a KrF laser and saturated pyrene/acetone solution (0.4 mol dm -3 ). 23,26) Because the projection lens has a limited depth of focus, the silica plate was moved further from the projection lens after irradiation of every 1000 pulses in order to adjust the position of the interface between the silica plate and the solution to the imaging area of the projection lens.…”

Section: Methodsmentioning

confidence: 99%

Surface Micro-Structuring of Silica Glass by Laser-induced Backside Wet Etching

Niino

Kawaguchi

Sato

et al. 2008

The Review of Laser Engineering

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We have investigated a one-step method to fabricate a microstructure on a silica glass plate by using laser-induced backside wet etching (LIBWE) that consists of excimer laser mask projection system and diode-pumped solid state (DPSS) laser beam scanning system. Well-defined deep microtrenches without crack formations on a fused silica glass plate were fabricated by LIBWE method with the UV lasers. We have demonstrated the microof pits-array and patterned grating on the surface of silica glass plates by LIBWE method at nm and 266 nm with dye solutions. The two new systems allow us to use rapid prototyping high precision surface microfabrication of silica glass as laser direct-write processing.

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Laser-induced high-quality etching of fused silica using a novel aqueous medium

Cited by 64 publications

References 0 publications

Laser Direct-Write Processing

Laser Direct-Write Processing

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Surface Micro-Structuring of Silica Glass by Laser-induced Backside Wet Etching

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