Laser lift-off of polyimide thin-film from glass carrier using DPSS laser pulses of top-hat square profiles

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

“…Currently, the commonly used laser wavelengths range from ultraviolet (254 nm, 308 nm, 355 nm) to infrared (1064 nm) [68,70,72,83]. According to previous reports in the literature, the principles of laser ablation of materials mainly include the photothermal effect or photochemical effect.…”

Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress

“…Reproduced with permission. [82] Copyright 2021, Elsevier. d) Scheme of the fs-LLO pattern showing pulse overlap and number.…”

“…For DPSS lasers with lower single-pulse energy, a common solution is to increase the pulse repetition frequency of the laser beam. As shown in Figure 11c, Kim et al [82] developed a new LLO system for large-window display panels using a DPSS UV laser with a square-topped beam. Notably, massively parallel laser-enabled transfer (MPLET) technology diffracts the beam into tens of thousands of sub-beams through diffractive optical elements (DOEs), enabling tens of thousands of times faster LED dies pick/place rates when scanned with an X-Y laser scanner, and even achieve a transfer rate of over million transfers per hour.…”

“…c) Schematic description of the scanning LLO process using Galvanomirror and f-theta lens. Reproduced with permission [82]. Copyright 2021, Elsevier.…”