Laser Micromachining of Glass, Silicon, and Ceramics

Abstract

A brief review is focused on laser micromachining of materials. Micromachining of materials is highly widespread method used in many industries, including semiconductors, electronic, medical, and automotive industries, communication, and aerospace. This method is a promising tool for material processing with micron and submicron resolution. In this paper micromachining of glass, silicon, and ceramics is considered. Interaction of these materials with laser radiation and recent research held on laser material treatment is provided.

Photonic Nanojet Sub-Diffraction Nano-Fabrication With <italic>in situ</italic> Super-Resolution Imaging

“…Because of optical diffraction-limit effects, continuous laser processing has been restricted by resolution limitations, i.e., resolutions better than 200 nm have been difficult to achieve. Several methods have been applied to improve laser processing resolution, including ultrafast laser processing [9]- [12], nearfield effects [13]- [17], and proper sample material selection [18], [19]. Currently, femtosecond lasers are widely used in industry as a noncontact method for fabricating micro-devices [20]- [22] or realizing surface micro-structures [23], [24].…”

Investigations on the Wear Rate of Sintering Diamond Core Bit during the Hole Drilling Process of Al2O3 Bulletproof Ceramics

“…At present, special processing technologies are usually adopted for the machining of hard and brittle materials such as engineering ceramics, including laser processing [1,2], electrical discharge machining [3,4], ultrasonic machining [5,6], and so on. Bharatish et al [1] performed CO 2 laser drilling tests of 2 mm-thick Al 2 O 3 ceramic plates to examine the effects of laser parameters such as pulse frequency, laser power, scanning speed, and hole diameter on entrance circularity, exit circularity, heat affected zone, and taper.…”

“…Bharatish et al [1] performed CO 2 laser drilling tests of 2 mm-thick Al 2 O 3 ceramic plates to examine the effects of laser parameters such as pulse frequency, laser power, scanning speed, and hole diameter on entrance circularity, exit circularity, heat affected zone, and taper. Rihakova and Chmelickova [2] made a review about the laser micromachining of glass, silicon, and ceramics. Interaction of these materials with laser radiation and the mechanisms of laser micromachining of materials were provided.…”

Determinação da dependência temporal dos parâmetros de ablação por pulsos ultracurtos de sólidos não-metálicos pela técnica D-Scan

“…Sistemas e circuitos microusinados [10][11][12][13][14] são dispositivos importantes dentro da concepção atual de tecnologia, e muitas são as áreas do conhecimento que utilizam dispositivos de tamanho reduzidos como os setores automobilístico [5] , aeroespacial [15,16] , e mesmo aqueles ligados a aplicações médicas [17] se beneficiam do desenvolvimento de microbombas, microválvulas, microrreatores entre outros dispositivos que podem ser construídos.…”

“…Novas portas foram abertas neste campo científico tanto para o desenvolvimento de lasers de pulsos com largura temporal menores (attossegundosque corresponde ao período orbital do elétron no átomo de hidrogênio [32,33] ) e altíssimas potências de pico (que hoje atingem vários PW e intensidades acima de 10 22 W/cm 2 ) [30,34] , quanto para suas aplicações nas diversas áreas do conhecimento [5,[15][16][17] devido à suas características ímpares. Com o passar dos anos, lasers com potências pico de vários TW e durações de poucos femtossegundos tornaram-se acessíveis a laboratórios de institutos de pesquisa e universidades.…”