Laser microplasma as a spot tool for glass processing: Focusing conditions

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

“…Moreover, the residual products of the pre-structuring on the glass surface (type III) facilitated deposition, leading to an even greater amount of deposited copper ( Figure 2 b). This effect can be explained not only by the surface topology modification [ 46 , 47 ], but also by the enhanced absorption of laser radiation by the residual species, which led to more efficient heating and to the reduction of copper ions in the eutectic solvent. This assumption lies in agreement with the considerable widening of the structure, despite the increase in scanning speed ( Figure 2 a,b), and confirms that the main driving force of the process is thermal reduction [ 25 ], in contrast with photoinitiated deposition, using photodegradable precursors [ 51 , 52 ].…”

“…), which makes fine tuning the processing conditions possible [ 42 , 43 , 44 , 45 ]. The features of the deposition process and the parameters affecting its efficiency have been studied; the importance of surface pre-activation of the acceptor substrate, with the laser-induced microplasma technique [ 46 , 47 ], has also been highlighted and analyzed. Furthermore, new promising areas of research have been outlined, including the formation of laser-induced periodic surface structures (LIPSSs).…”