Laser soldering of surface-mounted devices for high-reliability applications

Semerad, E.; Musiejovsky, L.; Nicolics, J.

doi:10.1007/bf00361180

Cited by 19 publications

(5 citation statements)

References 1 publication

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“…JONG-HYUN LEE, 1 In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solder/Cu pad interface and the shear strength of the joints were investigated. It was demonstrated that a proper combination of the variables could lead to the formation of a spherical solder bump with shear strength comparable to that formed via the conventional reflow soldering process.…”

Section: Characteristics Of the Sn-pb Eutectic Solder Bump Formed Viamentioning

confidence: 99%

“…[1][2][3][4][5][6] The unique characteristics of the laser; high energy input rate with a local heating capability, makes the process a potential technique for a fluxless reflow bumping in the area array type such as ball grid array (BGA) electronic packages. [1][2][3][4][5][6] The unique characteristics of the laser; high energy input rate with a local heating capability, makes the process a potential technique for a fluxless reflow bumping in the area array type such as ball grid array (BGA) electronic packages.…”

Section: Introductionmentioning

confidence: 99%

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Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Lee

Park

Moon³

et al. 2000

Journal of Elec Materi

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Section: Characteristics Of the Sn-pb Eutectic Solder Bump Formed Viamentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Lee

Park

Moon³

et al. 2000

Journal of Elec Materi

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“…In this way, also tendencies in the formation of intermetallic phases and of the metallurgical structure of the solder can be predicted. Both phenomena are essential for the solder joint quality [6,7].…”

Section: Introductionmentioning

confidence: 99%

Numerical Analysis of Transient Temperature Distributions During Laser Soldering

Nicolics

Hobler

1994

COMPEL

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractFast laser soldering processes are very attractive for the production of miniaturized interconnections with high reliability as they allow solder joint quality assurance during soldering. In order to evaluate the solder joint quality temporal changes of the temperature distribution inside the solder joint due to melting of the solder and wetting of the component and the pad metallizations must be well understood.In this paper we present thermal simulations of fast laser soldering processes taking the essential changes of the solder geometry into account. Moreover, we use a new relation for the calculation of the moment of wetting in dependence of the interface temperature. With this model the influence of the wettability of the pad and the component metallization and of the position of the laser beam on the temperature distribution inside the solder joint are investigated.

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“…However, to solve the thermal issue of hybrid integrated PICs, localized soldering with accurate heating control is a better option [20]. Laser soldering is a good candidate because of the advantages of non-tactile heating, highly localized thermal energy, good accessibility, and short soldering times allowing a highthroughput process [21], [22], [23], [24], [25]. Laser soldering is also promising to reduce the thermal stress for bonding a hybrid combination of III-V on Si PICs with different CTE values.…”

mentioning

confidence: 99%

Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering

Tian

Beste

Khachikyan

et al. 2023

IEEE J. Quantum Electron.

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Laser soldering of surface-mounted devices for high-reliability applications

Cited by 19 publications

References 1 publication

Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Numerical Analysis of Transient Temperature Distributions During Laser Soldering

Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering

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