“…With the advancement of optoelectronic device miniaturization and various advantages, such as low energy consumption, advanced design, compact structure, and high reliability, individual lasing sources must be scaled down and integrated into small areas or volumes to a microscale or even a nanoscale. ,− The construction of laser devices, typically carried out through high cost, high-temperature vacuum processing, and rigid substrates, has become increasingly complex, time-consuming, and expensive. ,− In essence, achieving high-performance micro- and nanolasers upon electrical pumping remains challenging, primarily due to several drawbacks: (i) Significant nonradiative loss occurs at high carrier density levels necessary for population inversion; , (ii) small cavities inherently possess high electrical resistance; , (iii) resistant heat loss is generated within metal/semiconductor and p–n junction region; (iv) lasing suppression can be induced by conductive functional layers in electroluminescence (EL) devices; and (v) substantial losses occur around the resonant cavity due to high-level current injection and other factors. , These perspectives pose substantial obstacles to further advancement of realistic microlaser devices. Therefore, it is imperative to propose rational laser structures.…”