The trend toward more mobile applications drives a rapidly increasing demand for non‐volatile memories. Today, Flash‐type non‐volatile memories offer by far the best trade‐off between cost and performance. In this chapter, Flash concepts relevant to today and the future are reviewed. Following a brief introduction to the market and the history of Flash memories, the basics required to understand the concepts of Flash memory concepts are explained. These mechanisms are involved in charging and discharging the charge storage layer, as well as the architecture used to combine many cells into large memory arrays. The third section details today's mainstream Flash concepts, which are based on the floating‐gate cell, outlines the physics of the floating‐gate transistor, and introduces the concepts of NOR and NAND Flash. Finally, the main reliability‐determining effects are reviewed, and the further scaling path of floating‐gate memories is illustrated. One way of overcoming the limitations of floating‐gate memories is to replace the conductive floating gate with an insulating charge‐trapping layer; hence, the conventional silicon‐oxide‐nitride‐oxide‐silicon (SONOS) cell and its trade‐offs are explained. Multi‐bit charge trapping, a concept recently introduced for both code and data Flash applications is described in detail, and the scaling of charge‐trapping Flash devices is discussed. Finally, a brief introduction is provided to nanocrystal Flash memory devices, which represent another way of overcoming some basic limitations of the floating gate.