Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

Pun, Kong-Pang; Ali, Lafir; Kohtoku, Makoto; Cheung, Chee-Wah; Chan, Alan H. S.; Wong, Ching‐Ping

doi:10.1007/s10854-018-8680-5

Cited by 3 publications

(1 citation statement)

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“…High-frequency microwave communication had been widely and rapidly used in new intelligent technologies such as artificial intelligence, internet of things, quantum computing, and so forth. , However, the mutual interference easily occurred during microwave signal transmission between microstrip conductors in integrated circuits and systems, leading to resistance-capacitance time delay, an increase in crosstalk, and more energy consumption. , To reduce resistance-capacitance time delay and crosstalk interference, low dielectric constant and low dielectric loss polymer composites with controllable dielectric properties had increasingly been studied to satisfy characteristic impedance matching in different transmission conditions. − …”

Section: Introductionmentioning

confidence: 99%

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Zhang

Zhou

et al. 2019

Ind. Eng. Chem. Res.

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To solve film formation and creep of nonvulcanized polybutadiene liquid rubber, it was designed and fabricated as a thermosetting, transferable, and symmetrical “sandwich” structure adhesive film through solution coating processing. The adhesive failure evolved from an independent cohesive failure or interfacial failure to a randomly staggered interfacial failure. According to the molecular dynamic simulation, compared to the molecular structure of 1,4-polybutadiene, the isolated π electron cloud of the vinyl side chain of 1,2-polybutadiene can form “chemical-like bonding” with the outer electrons of copper atoms. Meanwhile, the peel strength of the surface-modified polybutadiene adhesive (28.16 N/25 mm) was about three times that of the untreated one (10.11 N/25 mm), and its dielectric properties (ε′ = 2.416 and tan δ = 0.0026) maintained an ultralow level at 10 GHz, which was mainly decided by the electronic and atomic polarization of vinyl. This strategy was helpful to develop a processing method for the adhesive film of nonvulcanized liquid rubber and apply to high-speed signal transmission.

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