Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm

Monier-Vinard, Eric; Bissuel, Valentin; Laraqi, Najib; Dia, Cheikh Tidiane

doi:10.1109/itherm.2014.6892390

Cited by 23 publications

(5 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The largest source and the smallest one represent respectively 22.4% and 1.8% of the chip volume. In this fictive case, the conventional method used to create dynamic compact thermal models can hardly be applied [22]. First, based on the superposition principle, the number of mandatory simulations (JEDEC 38-set scenarios) to correctly identify the resistances network must be multiplied by ten.…”

Section: Impact Of Chip Power Dissipation Layoutmentioning

confidence: 99%

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

et al. 2020

Self Cite

View full text Add to dashboard Cite

The concept of a single-input/multi-output thermal network was proposed by the Development of Libraries of Physical models for an Integrated design environment (DELPHI) consortium more than twenty years ago. The present work highlights the recent improvements made to efficiently derive a low-computing-effort model from a fully detailed numerical model and to characterize its performances. The temperature predictions of a deduced ball-grid-array (BGA) dynamic compact thermal model are compared to those of a realistic three-dimensional representation, including the large set of internal copper traces, as well as its board structure, which has been validated by experiment. The current study discloses a method for creating an amalgam reduced-order modal model (AROMM) for that electronic component family that allows the preservation of the geometry integrity and shortening scenarios computation. Typically, the AROMM method reduces by a factor of 600 the computation time needed to obtain the solution while keeping the error on the maximum temperature below 2%. Then, a meta-heuristic optimization is run to derive a more practical low-order resistor capacitor model that enables a thermo-fluidic analysis at the board level. Based on the calibrated numerical model, a novel AROMM method was investigated in order to address the chip behavior submitted to multiple heat sources. The first results highlight the capability to enforce a non-uniform power distribution on the upper surface of the silicon chip. Thus, the chip design layout can be analyzed and optimized to prevent thermal and reliability issues.

show abstract

Section: Impact Of Chip Power Dissipation Layoutmentioning

confidence: 99%

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

et al. 2020

Self Cite

View full text Add to dashboard Cite

show abstract

“…For CTMs generation, the Delphi's method has been revised to enhance its relevance and effectiveness. The added steps are discussed in [10,14,23]. As mentioned, the steps for the identification of the thermal capacities are given in [12,13].…”

Section: Dynamical Compact Thermal Modelsmentioning

confidence: 99%

“…Moreover, the model suitability can be controlled from a temperature weight factor, name ω. To improve the accuracy of the derived CTM, a GA optimization of the node number describing the overall surfaces of the component can be done [14]. Each surface is then subdivided in a set of more appropriate isothermal areas.…”

Section: Dynamical Compact Thermal Modelsmentioning

confidence: 99%

See 1 more Smart Citation

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Rogié

Codecasa

Monier-Vinard

et al. 2018

Microelectronics Reliability

Self Cite

View full text Add to dashboard Cite

Delphi-like boundary condition independent (BCI) compact thermal models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI dynamical CTM (DCTM), based on model order reduction (MOR) were developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is proposed. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied, at first on a single-chip package (QFN16) then on a dual-chip package (DFN12). Their derived CTM and DCTM have been compared in term of accuracy and creation time using, or not, MOR reduction technique. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and consequently reduce the thermal network creation time by 80%.

show abstract

“…References [30,31] are dedicated to parameters estimation of thermal models of electronics devices in the Delphi-inspired form. To this end, genetic algorithms are used.…”

Section: Introductionmentioning

confidence: 99%

Compact Thermal Model of the Pulse Transformer Taking into Account Nonlinearity of Heat Transfer

Górecki

Detka

Górski³

2020

Energies

View full text Add to dashboard Cite

This paper presents a compact nonlinear thermal model of pulse transformers. The proposed model takes into account differentiation in values of the temperatures of a ferromagnetic core and each winding. The model is formulated in the form of an electric network realising electrothermal analogy. It consists of current sources representing power dissipated in the core and in each of the windings, capacitors representing thermal capacitances and controlled current sources modelling the influence of dissipated power on the thermal resistances in the proposed model. Both self-heating phenomena in each component of the transformer and mutual thermal couplings between each pair of these components are taken into account. A description of the elaborated model is presented, and the process to estimate the model parameters is proposed. The proposed model was verified experimentally for different transformers. Good agreement between the calculated and measured waveforms of each component temperature of the tested pulse transformers was obtained. Differences between the results of measurements and calculations did not exceed 9% for transformers with a toroidal core and 13% for planar transformers.

show abstract

Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm

Cited by 23 publications

References 5 publications

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Compact Thermal Model of the Pulse Transformer Taking into Account Nonlinearity of Heat Transfer

Contact Info

Product

Resources

About